Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
PIM523 Pimoroni	RGB POTENTIOMETER BREAKOUT	42
PIM553 Pimoroni	PIMORONI PICO VGA DEMO BASE	0
4TR-ROBOHAT Pimoroni	ROBOHAT - COMPLETE ROBOTICS CONT	0
POL-3750 Pimoroni	POLOLU DUAL G2 HIGH-POWER MOTOR	0
PIM300 Pimoroni	PICO HAT HACKER	0
PIM242 Pimoroni	RAINBOW HAT (RAINBOW HAT ONLY)	10
PIM353 Pimoroni	SCROLL:BIT	10
PIM433 Pimoroni	INKY WHAT YELLOW/BLACK/WHITE EPD	15
PIM543 Pimoroni	PICO DISPLAY PACK	0
PIM356 Pimoroni	NOISE:BIT	10
PIM527 Pimoroni	LED DOT MATRIX BREAKOUT GREEN	16
PIM299 Pimoroni	INKY PHAT - RED/BLACK/WHITE EPD	25
PIM355 Pimoroni	ENVIRO:BIT	62
PIM035 Pimoroni	FLOTILLA DIAL W/ LEDS	13
PIM268 Pimoroni	SCROLL PHAT HD	23
PIM480 Pimoroni	SGP30 AIR QUALITY SENSOR BREAKOU	0
KIT-5620 Pimoroni	MOTOR DRIVER BOARD V2 FOR THE BB	0
1SHEELD Pimoroni	1SHEELD+ FOR SMARTPHONE	0
PIM273 Pimoroni	UNICORN HAT HD 16X16 RGB LED	0
PIM029 Pimoroni	FLOTILLA NUMBER 7 SEGMENT	14

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems