Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
PIM321

PIM321

Pimoroni

PHAT STACK SOLDER YOURSELF KIT

0

MOPI003

MOPI003

Pimoroni

MOPI 2: HOT-SWAP MOBILE POWER FO

5

PIM058

PIM058

Pimoroni

SKYWRITER HAT (INDIVIDUAL)

4

PIM371

PIM371

Pimoroni

AUTOMATION:BIT

33

PIM365

PIM365

Pimoroni

MLX90640 THERMAL CAMERA BREAKOUT

0

PIM266

PIM266

Pimoroni

FOUR LETTER PHAT

0

PIM484

PIM484

Pimoroni

PIRATE AUDIO 3W STEREO AMP FOR R

20

PIM377

PIM377

Pimoroni

BREAKOUT GARDEN HAT

0

MNK00062

MNK00062

Pimoroni

SENSOR FOR MICRO:BIT

6

PIM412

PIM412

Pimoroni

AS7262 6-CHANNEL SPECTRAL SENSOR

4

PIM438

PIM438

Pimoroni

MAX30105 BREAKOUT - HEART, SMOKE

21

PPMB00130

PPMB00130

Pimoroni

AMP:BIT CLASS D AMPLIFIER FOR MI

0

KIT-5601B

KIT-5601B

Pimoroni

EDGE CONNECTOR BREAKOUT BOARD FO

0

CAM009

CAM009

Pimoroni

160 (FISHEYE) NIGHT VISION CAMER

30

PIM436

PIM436

Pimoroni

0.96" SPI COLOUR LCD (160X80)

22

PIM555

PIM555

Pimoroni

PICO DECKER (QUAD EXPANDER)

0

PIM483

PIM483

Pimoroni

PIRATE AUDIO LINE-OUT FOR RASPBE

19

4TR-PICONZ

4TR-PICONZ

Pimoroni

PICON ZERO - INTELLIGENT ROBOTIC

7

PIM033

PIM033

Pimoroni

FLOTILLA AMBIENT LIGHT SENSOR

11

RASPIO-001

RASPIO-001

Pimoroni

RASPIOA DUINO

12

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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