Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
4648

4648

Adafruit

ADAFRUIT PCF8591 QUAD 8-BIT ADC

28

GEN4-4DCAPE-43CT-CLB

GEN4-4DCAPE-43CT-CLB

4D Systems

LCD CAPE 4.3" CAP TOUCH

25

EVAL-CN0395-ARDZ

EVAL-CN0395-ARDZ

Analog Devices, Inc.

CN0395

2

PIS-1128

PIS-1128

Pi Supply

IOT LORA NODE PHAT 868MHZ/915MHZ

41

SEN0114

SEN0114

DFRobot

SOIL MOISTURE SENSOR (ARDUINO CO

20

MIKROE-2508

MIKROE-2508

MikroElektronika

ECG 2 CLICK BUNDLE

7

MIKROE-4560

MIKROE-4560

MikroElektronika

VOLUME 2 CLICK

0

DFR0055

DFR0055

DFRobot

GRAVITY:TERMINAL SENSOR ADAPTER

10

S5U13513R00C100

S5U13513R00C100

Epson

BOARD EVAL FOR BEAGLEBONE BLACK

0

ISOIOM17427-4

ISOIOM17427-4

Made Systems

ISOLATED I/O WITH 4 RELAY OUTPUT

25

PIM523

PIM523

Pimoroni

RGB POTENTIOMETER BREAKOUT

42

MIKROE-3445

MIKROE-3445

MikroElektronika

MIC 2 CLICK

0

MIKROE-2555

MIKROE-2555

MikroElektronika

GAINAMP CLICK

0

106990020

106990020

Seeed

SOLAR CHARGER SHIELD V2.2

51

EVAL-AD7686-PMDZ

EVAL-AD7686-PMDZ

Analog Devices, Inc.

EVAL BOARD 16BIT 500K ADC AD7686

1

SEN-15577

SEN-15577

SparkFun

PULSED RADAR BREAKOUT - A111

13

MIKROE-1201

MIKROE-1201

MikroElektronika

BOARD 7SEG CLICK

33

ASX00006

ASX00006

Genuino (Arduino)

ARDUINO MKR ETH SHIELD

16

2078

2078

Adafruit

SHIELD PWRBOOST 500 RECHARGE 5V

4

KITXMCLEDDALI20RGBTOBO1

KITXMCLEDDALI20RGBTOBO1

IR (Infineon Technologies)

XMC 3CH RGB LED SHIELD XMC1302

6

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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