Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
EVAL-AD7688-PMDZ

EVAL-AD7688-PMDZ

Analog Devices, Inc.

EVAL BOARD 16BIT 500K ADC AD7688

2

2927

2927

Adafruit

DC MOTOR + STEPPER FEATHERWING A

115

AC320005-4

AC320005-4

Roving Networks / Microchip Technology

HIGH-PERFORMANCE WQVGA DISPLAY M

0

X-NUCLEO-IHM13A1

X-NUCLEO-IHM13A1

STMicroelectronics

NUCLEO BRD STSPIN250 MOTOR DRVR

18

MIKROE-1295

MIKROE-1295

MikroElektronika

DISPLAY BOARD 8X8 RED CLICK

4

MIKROE-3844

MIKROE-3844

MikroElektronika

SINGLE CELL CLICK

4

2423

2423

Adafruit

DISPLAY PITFT PLUS 320X240 2.8

0

114991396

114991396

Seeed

FLICKZERO3D TRACK & GESTURE PHAT

0

FWNG-TRP

FWNG-TRP

Particle

PARTICLE FEATHERWING TRIPLER

270

SCSHD-01

SCSHD-01

OSEPP Electronics

MOTOR AND SERVO SHIELD

664

MIKROE-4296

MIKROE-4296

MikroElektronika

EEPROM 6 CLICK

5

410-355

410-355

Digilent, Inc.

PMOD CMPS2: 3-AXIS COMPASS

3

4818

4818

Adafruit

KEYBOARD FEATHERWING - QWERTY KE

0

DEV-12085

DEV-12085

SparkFun

BEAGLEBONE BLACK CAPE - LCD (4.3

0

P0481

P0481

Terasic

NET-FMC CARD

5

PIM553

PIM553

Pimoroni

PIMORONI PICO VGA DEMO BASE

0

X-NUCLEO-IKS01A3

X-NUCLEO-IKS01A3

STMicroelectronics

X-NUCLEO-IKS01A3

250

BLDCSHIELDIFX007TTOBO1

BLDCSHIELDIFX007TTOBO1

IR (Infineon Technologies)

EVAL (BL)DC MOTOR CONTROL SHIELD

70

MIKROE-3816

MIKROE-3816

MikroElektronika

LIN CLICK

3

ASD2511-R-N

ASD2511-R-N

TinyCircuits

9-AXISTINYSHIELD

2

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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