Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3847 MikroElektronika	BUCK 14 CLICK	3
MIKROE-2239 MikroElektronika	MATRIX RGB CLICK	0
PIM300 Pimoroni	PICO HAT HACKER	0
MIKROE-3276 MikroElektronika	LLC-I2C CLICK	37
308010014 Seeed	RASPBERRY PI 3.5" TFT DISPLAY	19
MIKROE-2300 MikroElektronika	MIKROMEDIA HMI BREAKOUT BOARD	0
MIKROE-2956 MikroElektronika	CLICK ANALYZER	1
MIKROE-2912 MikroElektronika	STEPPER 7 CLICK	0
GEN4-4DCAPE-70CT-CLB 4D Systems	LCD CAPE 7.0" CAP TOUCH	0
DEV-15270 SparkFun	GATOR:LOG - MICRO:BIT ACCESSORY	8
DEV-17156 SparkFun	SPARKFUN QWIIC SHIELD FOR TEENSY	61
SEN0232 DFRobot	GRAVITY: ANALOG SOUND LEVEL METE	61
ASD2413-R-LA TinyCircuits	TINYSHIELDMATRIXLEDS AMBER	0
EVAL-CN0416-ARDZ Analog Devices, Inc.	ISOLATED AND NON-ISOLATED RS-485	2
SEN-14587 SparkFun	SPARKFUN TRIPLE AXIS ACCELEROMET	28
MIKROE-4044 MikroElektronika	6DOF IMU 6 CLICK	3
EVAL-CN0332-PMDZ Analog Devices, Inc.	PMOD BRD AMR SENSOR CONDITIONER	2
NHD-7.0CTP-CAPE-V Newhaven Display, Intl.	LCD 7" TOUCH PRM BEAGLEBONE CAPE	98
K052 M5Stack	ATOM POE KIT WITH W5500 (HY60174	0
MIKROE-2455 MikroElektronika	ECG CLICK	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems