Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
410-201 Digilent, Inc.	BOARD PMODRF2 FOR MRF24J40	2
MIKROE-3854 MikroElektronika	H-BRIDGE 5 CLICK	3
SPX-17115 SparkFun	SERIAL FLASH BREAKOUT - ASSEMBLE	0
MIKROE-4110 MikroElektronika	DIGI POT 6 CLICK	8
PIM242 Pimoroni	RAINBOW HAT (RAINBOW HAT ONLY)	10
MIKROE-2544 MikroElektronika	RN4871 CLICK	47
AST1011 TinyCircuits	JOYSTICK WIRELING	49
410-113 Digilent, Inc.	BOARD PMODDA2 FOR DAC121S101	50
DRI0009 DFRobot	2A MOTOR SHIELD FOR ARDUINO	12
PIM353 Pimoroni	SCROLL:BIT	10
113030009 Seeed	GPRS SHIELD V3.0	0
PIM433 Pimoroni	INKY WHAT YELLOW/BLACK/WHITE EPD	15
SEN-14347 SparkFun	QWIIC SPECTRAL SENSOR BRD AS7262	28
BP-ADS7128 Texas Instruments	EVALUATION BOARD FOR ADS7128	719
111020049 Seeed	GROVE MECH KEYCAP	2
MIKROE-3739 MikroElektronika	THINGSTREAM CLICK	3
ASD2431-R TinyCircuits	TINYSCREENOLEDTINYSHIELD	20
MIKROE-2746 MikroElektronika	UT-M 7-SEG R CLICK	0
ATQT7-XPRO Roving Networks / Microchip Technology	QT7 XPLAINED PRO EXTENSION KIT	7
ZIO-101946 Smart Prototyping/NOA Labs	ZIO QWIIC TO GROVE ADAPTER BOARD	500

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems