Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
ALS-GEVB Sanyo Semiconductor/ON Semiconductor	ALS SHIELD	8
RB-LYN-1052 RobotShop	LSS 5V REGULATOR BOARD	7
POE_BOARD Raspberry Pi	PI 3B+ POWER OVER ETHERNET HAT	574
MIKROE-4496 MikroElektronika	TEMP&HUM 15 CLICK	5
DFR0029-R DFRobot	GRAVITY: DIGITAL PUSH BUTTON (RE	5
PIS-1127 Pi Supply	IOT LORA GATEWAY HAT - 915 MHZ	40
SHIELDBTS500151TADTOBO1 IR (Infineon Technologies)	EVAL 12V PROTECT SWITCH SHIELD	3
MIKROE-3880 MikroElektronika	M-BUS MASTER CLICK	19
STEVAL-MKI219V1 STMicroelectronics	LPS22CH ADAPTER BOARD FOR A STAN	30
SHIELD-MIDI Olimex	OLIMEX ARDUINO MIDI SHIELD	0
PIM543 Pimoroni	PICO DISPLAY PACK	0
DFR0554 DFRobot	GRAVITY: I2C 16X2 ARDUINO LCD WI	30
MIKROE-4467 MikroElektronika	I2C ISOLATOR 3 CLICK	4
MIKROE-4089 MikroElektronika	6DOF IMU 5 CLICK	14
MIKROE-4105 MikroElektronika	ADC 9 CLICK	17
AC243008 Roving Networks / Microchip Technology	SERIAL SUPERFLASH(R) KIT 2	2
MIKROE-4487 MikroElektronika	BLE 9 CLICK	5
LEDRD-01 OSEPP Electronics	LED MODULE - RED	514
AC240100 Roving Networks / Microchip Technology	PICTAIL PLUS EXPANSION BOARD	41
3654 Adafruit	WINC1500 WIFI SHIELD WITH UFL CO	38

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems