Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
CAN-MANGOH Sierra Wireless by Talon	MANGOH CAN BUS	118
4354 Adafruit	PERMA-PROTO 40-PIN RASPBERRY PI	58
DFR0144 DFRobot	RELAY SHIELD FOR ARDUINO V2.1	15
SEN-15242 SparkFun	SPARKFUN QWIIC SCALE - NAU7802	153
X-NUCLEO-USBPDM1 STMicroelectronics	NUCLEO TYPE-C PWR DELIVERY SINK	18
MATRIX.V1E.K MATRIX Labs	KIT- AUDIO W/ ESP32 MCU APP DEV	107
103100063 Seeed	GROVE SHIELD FOR MICRO:BIT V2.0	10
104020130 Seeed	GROVE RED/BLACK/WHITE 2.13" EPD	13
SEN0236 DFRobot	GRAVITY I2C BME280 ENVIRONMENTA	11
SEN0321 DFRobot	GRAVITY I2C OZONE SENSOR	41
24VSHIELDBTT6030TOBO1 IR (Infineon Technologies)	EVAL 24V PROTECT SWITCH SHIELD	40
MIKROE-4309 MikroElektronika	NFC 2 CLICK	6
U053 M5Stack	ENV HAT (DHT12, BMP280, BMM150)	0
MIKROE-1435 MikroElektronika	RF TXRX MOD ISM>1GHZ TRACE ANT	0
MIKROE-2273 MikroElektronika	THERMOSTAT CLICK	0
DFR0063 DFRobot	I2C 16X2 ARDUINO LCD DISPLAY MOD	0
MIKROE-1197 MikroElektronika	BOARD THERMO CLICK	3
MIKROE-3439 MikroElektronika	PROXIMITY 8 CLICK	5
S2GO3DTLE493DW2B6A0TOBO1 IR (Infineon Technologies)	TLE493DW2B6 3DSENSE SHIELD2GO	56
DFR0347 DFRobot	2.8&QUOT TFT TOUCH SHIELD WITH	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems