Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SPX-17718 SparkFun	MICROMOD BIG DISPLAY CARRIER BOA	0
MIKROE-922 MikroElektronika	BOARD ACCY ADC CLICK MCP3204	4
SRVCPE-BBBCAPE GHI Electronics, LLC	BEAGLEBONE SERVO CAPE	173
AC320004-7 Roving Networks / Microchip Technology	KSZ8863 PHY DAUGHTER BOARD	0
104030008 Seeed	GROVE OLED DISPLAY 0.96"	91
DFR0420 DFRobot	AUDIO SHIELD FOR DFRDUINO M0	8
MIKROE-2237 MikroElektronika	MANOMETER CLICK	0
MIKROE-3359 MikroElektronika	EEG CLICK	4
AC320032-3 Roving Networks / Microchip Technology	BM64 BLUETOOTH RADIO DAUGHTER BO	2
MIKROE-3440 MikroElektronika	ACCEL 11 CLICK	9
RASPIO-001 Pimoroni	RASPIOA DUINO	12
EV-COG-BLEINTP1Z Analog Devices, Inc.	CONNECTIVITY COG BRD AD3029LX/AD	1
MIKROE-1877 MikroElektronika	DEV BOARD 3D MOTION CLICK	0
MIKROE-2477 MikroElektronika	2X5W AMP CLICK	1
101020018 Seeed	GROVE WATER SENSOR	64
MIKROE-1639 MikroElektronika	STORM CHASER CLICK PACK	0
STEVAL-MKI220V1 STMicroelectronics	LPS27HHTW ADAPTER BOARD FOR A ST	30
MIKROE-4039 MikroElektronika	VCP MONITOR CLICK	26
TSX00083 Genuino (Arduino)	PROTO SHIELD REV3	109
114992543 Seeed	4-CHANNEL SPDT RELAY HAT FOR RAS	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems