Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
103990564 Seeed	WIO TERMINAL CHASSIS - BATTERY (	0
MIKROE-2103 MikroElektronika	COLOR 3 CLICK	0
MIKROE-1834 MikroElektronika	DEV BOARD TILT CLICK	2
MIKROE-2632 MikroElektronika	THERMO 4 CLICK	4
MIKROE-3301 MikroElektronika	SLIDER 2 CLICK	3
AST1036 TinyCircuits	TEMP/PRESSURE/HUMIDITY/VOC SENSO	24
MIKROE-1897 MikroElektronika	DEV BOARD LIGHTRANGER CLICK	2
MIKROE-2676 MikroElektronika	LED DRIVER CLICK	0
SEN0249 DFRobot	GRAVITY: ANALOG SPEAR TIP PH SEN	0
S2GOPRESSUREDPS310TOBO1 IR (Infineon Technologies)	EVAL PRESSURE DPS310	139
HUMI-01 OSEPP Electronics	HUMIDITY & TEMP SENSOR MODULE	53
EVAL-AD7687-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT 250K ADC AD7687	0
MIKROE-1990 MikroElektronika	CLICK BOARD RTC5 MCP79510	5
4821 Adafruit	ADAFRUIT TMP117 0.1C HIGH ACCURA	220
GPS-13750 SparkFun	SPARKFUN GPS LOGGER SHIELD	0
BOOSTXL-CC3120MOD Texas Instruments	CC3120 WIFI BOOSTERPACK BOARD	31
MCC 152	VOLTAGE OUTPUT AND DIO DAQ HAT	2
114990814 Seeed	RF EXPLORER 3G+ IOT RASPBERRY PI	9
MIKROE-4228 MikroElektronika	6DOF IMU 13 CLICK	9
410-123 Digilent, Inc.	PMODSD SD CARD SLOT MODULE	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems