Accessories

Part Number	Description / PDF	Quantity
MA330045 Roving Networks / Microchip Technology	DSPIC33CH512MP508 MOTOR CONTROL	5
AC162096 Roving Networks / Microchip Technology	HEADER MPLAB ICD2 PIC16F526 8/14	0
PCM16XW0 Roving Networks / Microchip Technology	MODULE PROCESSOR PIC16C781/782	1
DM320005-2 Roving Networks / Microchip Technology	BOARD EXPANSION II PIC32	0
ACICE0105 Roving Networks / Microchip Technology	MPLABICE PARALLEL CABLE	2
AC160214-1 Roving Networks / Microchip Technology	BOARD DEV LIGHTING DALI ADAPTER	2
ATARD-DBGADPT Roving Networks / Microchip Technology	DEBUG ADAPTER FOR ARDUINO XPRO	0
MA300016 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPICDEM 80TQFP	0
MA180037 Roving Networks / Microchip Technology	PIC18F26K83 PIM	5
AC244034 Roving Networks / Microchip Technology	EXTENSION PAK PIC18LF14K22-ICE	0
AT88CK301ADP Roving Networks / Microchip Technology	BOARD ADAPTER SOLUTION	0
AC11C60A Roving Networks / Microchip Technology	BIST XPLAINED PRO	0
EV94F66A Roving Networks / Microchip Technology	PIC32CM MOTOR CONTROL PIM	15
MSCNC4031U-10 Roving Networks / Microchip Technology	NSHIELD EDGE HSM USB DEVICE	0
MA180016 Roving Networks / Microchip Technology	MODULE PLUG-IN PICDEM HPC BLANK	6
MA240041 Roving Networks / Microchip Technology	PIC24FJ512GU410 GP PIM	11
MA330031 Roving Networks / Microchip Technology	MOD PIM DSPIC33EP256MC506 INT OA	4
MA330019 Roving Networks / Microchip Technology	PIM DSPIC33F MC 44P-100P QFN	5
AC162057 Roving Networks / Microchip Technology	14P ICD 2 HEADER (PIC16F636)	0
MA180020 Roving Networks / Microchip Technology	MODULE PLUG-IN HPC EXPL 18F87J11	6

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization