Accessories

Part Number	Description / PDF	Quantity
AC300022 Roving Networks / Microchip Technology	MOTOR 3PHASE W/ 250 LINE ENCODER	6
MA320017 Roving Networks / Microchip Technology	PIC32MX270F512L PIM FOR BT ADK	0
AC162070 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 8/14P	0
MA320003 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC32 CAN USB	46
PCM16YG0 Roving Networks / Microchip Technology	MODULE PROCESSOR PIC16F87,88	1
AC164111 Roving Networks / Microchip Technology	ADAPTER PM3 ICSP TO RJ-11	8
AC244033 Roving Networks / Microchip Technology	EXTENSION PAK PIC18F14K22-ICE	1
PCM18XK1 Roving Networks / Microchip Technology	MODULE PROC PIC18F8680,6680,8565	5
ATARDADPT-XPRO Roving Networks / Microchip Technology	BOARD ADAPTER FOR ARDUINO XPRO	3
MA990002 Roving Networks / Microchip Technology	CEC1712H-S2 PLUG-IN MODULE	2
MA180013 Roving Networks / Microchip Technology	MODULE PLUG-IN 18F45J10 44TQFP	0
MA330035 Roving Networks / Microchip Technology	MOD PIM DSPIC33EP512GM710 GP	4
AC162051 Roving Networks / Microchip Technology	HEADER INTRFC ICD,ICD2 28/40 DIP	6
ATATMEL-ICE-ADPT Roving Networks / Microchip Technology	ADAPTER SAM ICE	46
AC162091 Roving Networks / Microchip Technology	HEADER MPLAB ICD2 18F87J11 64/80	0
XLT08DFN2 Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 14DIP/8DFN	2
AC244035 Roving Networks / Microchip Technology	IC EXTENSION PAK PIC16F1939	0
AC002021 Roving Networks / Microchip Technology	CABLE MPLAB PM3 ICSP	44
ATXPRO-10PIN Roving Networks / Microchip Technology	XPRO-10PIN	5
MA330051-1 Roving Networks / Microchip Technology	DSPIC33CK64MC105 PIM MODULE	8

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization