Accessories

Part Number	Description / PDF	Quantity
MA990004 Roving Networks / Microchip Technology	CEC1702Q-B2 PLUG-IN MODULE	4
ATSTK600-LCDX Roving Networks / Microchip Technology	STK600 LCD FOR XMEGAB	0
PCM16XP1 Roving Networks / Microchip Technology	MODULE PROC PIC16F627,628	1
PCM16XQ1 Roving Networks / Microchip Technology	PROCESSOR MODULE PIC16C745,765	1
MA300014 Roving Networks / Microchip Technology	MODULE DSPIC30F SAMPLE 80QFP	5
ATICE50MEM Roving Networks / Microchip Technology	ICE50 EXTENSION MEMORY CARD	4
MA330039 Roving Networks / Microchip Technology	DSPIC33CH128MP508 PLUG-IN MODULE	4
DVA16XP280 Roving Networks / Microchip Technology	ADAPTER DEVICE FOR MPLAB-ICE	3
MA330050-1 Roving Networks / Microchip Technology	MOD PIM DSPIC33CK64MP105 EXT OA	10
MA990003 Roving Networks / Microchip Technology	CEC1702Q-S1 PLUG-IN MODULE	2
AC162058 Roving Networks / Microchip Technology	HEADER MPLAB ICD2 FOR PIC12F683	0
ATPROTO1-XPRO Roving Networks / Microchip Technology	XPLAINED PRO PROTOTYPING ADD-ON	17
PCM16XB1 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR MPLAB-ICE	1
MA180032 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC18F66K80	5
AC320101 Roving Networks / Microchip Technology	ADAPTER BOARD MEB/II UART TO USB	6
AC163022 Roving Networks / Microchip Technology	ADAPTER UNIVERSAL PROG PIC12F5XX	0
ATATMEL-ICE-CABLE Roving Networks / Microchip Technology	CABLE SAM ICE	252
TC2030-MCP-NL Roving Networks / Microchip Technology	CABLE TAG-CONNECT IN-CIRCUIT	50
AC163021 Roving Networks / Microchip Technology	KIT ADAPTER SOT23-6 TO 8P DIP	3
ATAVR-SOAKIT Roving Networks / Microchip Technology	KIT ADAPTER STANDOFF JTAG DEBUG	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization