| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
DEVICE ADAPTER FOR PIC17C42A |
1 |
|
 |
Roving Networks / Microchip Technology |
565 LCD GFX CARD |
5 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER DEVICE FOR MPLAB-ICE |
2 |
|
 |
Roving Networks / Microchip Technology |
USB BRIDGE BOARD |
34 |
|
 |
Roving Networks / Microchip Technology |
EXTENSION BOARD QT3-XPRO |
2 |
|
 |
Roving Networks / Microchip Technology |
AVRONE REPLACEMENT POWER SUPPLY |
6 |
|
 |
Roving Networks / Microchip Technology |
MOD PLUG-IN PIC24FJ256GB210 |
6 |
|
 |
Roving Networks / Microchip Technology |
MOD PIM PIC24EP512GU810 GP |
5 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER DEVICE ICE 18DIP/SOIC |
3 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN 18F87J10 FOR HPC |
0 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER PERSON ICE50 TINY2313 |
24 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTERFACE ICD2 16F688 |
0 |
|
 |
Roving Networks / Microchip Technology |
PIC32MX274F256D PIM FOR EXPLORER |
6 |
|
 |
Roving Networks / Microchip Technology |
BTLC1000-XPRO EXT ADAPTER BOARD |
6 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTRFC MPLAB ICD2 40/28P |
0 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTFC MPLABICD2 64/80/100 |
3 |
|
 |
Roving Networks / Microchip Technology |
VOLTAGE LIMITER MPLAB ICD2 VPP |
13 |
|
 |
Roving Networks / Microchip Technology |
HEADER MPLAB ICD2 24FJ64GA004 28 |
0 |
|
 |
Roving Networks / Microchip Technology |
MODULAR CABLE FOR MPLAB ICD 4 |
16 |
|
 |
Roving Networks / Microchip Technology |
DSPIC33CK64MC105 PIM MODULE |
5 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization