| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN PIC24F16KA102 PIM |
5 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER TEST ICE50 |
12 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN PIC24FJ1024GB610 |
6 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN DSPIC33E 100TQFP |
7 |
|
 |
Roving Networks / Microchip Technology |
MOD PIM PIC32MZ EF |
14 |
|
 |
Roving Networks / Microchip Technology |
XPLAINED PRO SEGMENT LCD ADD-ON |
2 |
|
 |
Roving Networks / Microchip Technology |
USBI2CAUTOPCB |
21 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTERFACE ICD,ICD2 18DIP |
0 |
|
 |
Roving Networks / Microchip Technology |
POE PROGRAMMER ADAPTER |
0 |
|
 |
Roving Networks / Microchip Technology |
DSPIC33CK256MP508 INTERNAL OPAMP |
2 |
|
 |
Roving Networks / Microchip Technology |
EXTENSION PAK PIC16(L)F1789 |
0 |
|
 |
Roving Networks / Microchip Technology |
POWER SUPPLY FOR MPLAB 3.3V/5V |
13 |
|
 |
Roving Networks / Microchip Technology |
KIT ETHERNET PRO |
6 |
|
 |
Roving Networks / Microchip Technology |
PIC18F66K80 100 PIN PLUG-IN MODU |
5 |
|
 |
Roving Networks / Microchip Technology |
MODULE PIC18F248/258/448/458 |
1 |
|
 |
Roving Networks / Microchip Technology |
MODULE PIM PIC24FJ256GB410 |
4 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN PIC16F1947 |
0 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTRFC MPLAB ICD2 18F1330 |
0 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN 18F85J11 |
0 |
|
 |
Roving Networks / Microchip Technology |
XPLAINED PRO 128X32 OLED ADD-ON |
19 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization