Accessories

Part Number	Description / PDF	Quantity
AC162079 Roving Networks / Microchip Technology	HEADER MPLAB ICD2 18F85J90 64/80	0
AC164110 Roving Networks / Microchip Technology	ADAPTER RJ-11 TO ICSP	421
ATQT6-XPRO Roving Networks / Microchip Technology	XPLAINED PRO EXTENSION	2
MA320211 Roving Networks / Microchip Technology	PIC32MK MCM MOTOR CONTROL PIM	0
AC244061 Roving Networks / Microchip Technology	EXTENSION PAK PIC16F527	3
MA330018 Roving Networks / Microchip Technology	PIM DSPIC33F MC 44P-100P QFN	0
MA180031 Roving Networks / Microchip Technology	MOD PLUG-IN 44PIN PIC18F46K80	6
MA180026 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC18F45K20	3
MA240016 Roving Networks / Microchip Technology	MODULE PLUG-IN 24HJ128GP504	5
XLT44QFN4 Roving Networks / Microchip Technology	SOCKET TRANS ICE 28DIP TO 44QFN	10
MSCNC4433E-500 Roving Networks / Microchip Technology	NSHIELD SOLO HSM PCIE CARD	0
AC002023 Roving Networks / Microchip Technology	CURRENT MEASUREMENT CABLE	5
MA240016-2 Roving Networks / Microchip Technology	DAUGHTER BOARD PIC24HJ	3
MA330051-2 Roving Networks / Microchip Technology	DSPIC33CK64MC105 PIM MODULE	8
MA240014 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC24	9
XLT44QFN2 Roving Networks / Microchip Technology	SOCKET TRAN ICE 44QFN/40DIP	1
MA180014 Roving Networks / Microchip Technology	MODULE PLUG-IN 18LF45J10 44TQFP	15
AC244054 Roving Networks / Microchip Technology	PIC16LF1459-ICE PROCR EXT PAK	0
AC162052 Roving Networks / Microchip Technology	14P ICD 2 HEADER	0
MA330016 Roving Networks / Microchip Technology	MODULE DSPIC33 44P-100P QFP GP	4

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization