Accessories

Part Number	Description / PDF	Quantity
MA330026 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC33FJ16MC102	4
ATADAPTINY13 Roving Networks / Microchip Technology	ADAPTER PERSON ICE50 TINY13	5
AC162060 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 20PIN	0
PCM18XQ2 Roving Networks / Microchip Technology	MODULE PROCESSOR FOR PIC18F8490	2
MA320012 Roving Networks / Microchip Technology	MOD PIM PIC32MZ2048EC 100PIN	5
ATIO1-XPRO Roving Networks / Microchip Technology	XPLAINED PRO I/O EVAL ADD-ON	64
MA180025 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC18F87J90 PIM	0
AC162062 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 64/80P	5
PCM16YB0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR PIC16C432	3
ADM00965 Roving Networks / Microchip Technology	CL88031 230VAC OFFLINE LED LOAD	0
MA160019 Roving Networks / Microchip Technology	PLUG-IN MODULE	8
AC244062 Roving Networks / Microchip Technology	EXTENSION PAK PIC16F570	0
ATSTK521 Roving Networks / Microchip Technology	EXPANSION MODULE ATSTK500	1
MA300015 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC30F 80QFP	5
AC300024 Roving Networks / Microchip Technology	MOTOR STEPPER 2PHASE 8WIRE	1
AC162069 Roving Networks / Microchip Technology	CABLE BREADBOARD MPLAB ICD 2	11
AC102014 Roving Networks / Microchip Technology	BOARD GATEWAY BLUETOOTH AUDIO	0
AC162055 Roving Networks / Microchip Technology	HEADER INTERFACE ICD2 16F684	0
ATQT600IB Roving Networks / Microchip Technology	BOARD INTERFACE ATQT600IB	6
MA320024 Roving Networks / Microchip Technology	PIC32MK1024 MOTOR CONTROL PIM	14

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization