| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
POWER SUPPLY FOR ICSP AC004004 |
3 |
|
 |
Roving Networks / Microchip Technology |
MOTOR 3-PH BRUSHLESS DC 24V |
0 |
|
 |
Roving Networks / Microchip Technology |
HEADER MPLAB ICD2 18F87J50 68/84 |
1 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN PIC24FJ128GA204 |
6 |
|
 |
Roving Networks / Microchip Technology |
PLC AC COUPLER |
2 |
|
 |
Roving Networks / Microchip Technology |
KIT AVR TOOLS USB/CABLE |
1 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN DSPIC33EP64MC504 |
0 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTRFC MPLAB ICD2 8/14PIN |
0 |
|
 |
Roving Networks / Microchip Technology |
MICTOR38 CONNECTOR NEXUS 767054- |
2 |
|
 |
Roving Networks / Microchip Technology |
HARDWARE ADAPTER KIT 10FPGA |
0 |
|
 |
Roving Networks / Microchip Technology |
ACCESSORY KIT FOR JTAGICE3 |
0 |
|
 |
Roving Networks / Microchip Technology |
MOD PIM BT AUDIO PIC32MX270256 |
0 |
|
 |
Roving Networks / Microchip Technology |
VICTORIA BLUETOOTH MP TEST BOARD |
5 |
|
 |
Roving Networks / Microchip Technology |
ADAPTR PIC32 ST BD TO EXPL16 PIM |
0 |
|
 |
Roving Networks / Microchip Technology |
PIC24FJ128GL306 GP PIM |
4 |
|
 |
Roving Networks / Microchip Technology |
DAUGHTER BOARD DSPIC33F |
0 |
|
 |
Roving Networks / Microchip Technology |
PLUG-IN MODULE |
0 |
|
 |
Roving Networks / Microchip Technology |
DSPIC33CK256MP508 EXTERNAL OPAMP |
16 |
|
 |
Roving Networks / Microchip Technology |
BOARD DAUGHTER PIC32 LAN8720 |
211 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTRFC MPLAB ICD2 44TQFP |
1 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization