Accessories

Part Number	Description / PDF	Quantity
MA330046 Roving Networks / Microchip Technology	DSPIC33CH512MP508 GENERAL PURPOS	30
ATADAPTINY26 Roving Networks / Microchip Technology	ADAPTER PERSON ICE50 ATTINY26	3
AC162061 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 20PIN	0
MA320020 Roving Networks / Microchip Technology	PIC32MM0064GPL036 GENERAL PURPOS	6
AC162050 Roving Networks / Microchip Technology	HEADER ICD2 FOR PIC12F629/675	0
MA180036 Roving Networks / Microchip Technology	PIC18F67K40 PIM	10
ATDH1150USB Roving Networks / Microchip Technology	JTAG ISP USB CABLE	27
AC162066 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 20PIN	10
DM320002 Roving Networks / Microchip Technology	BOARD EXPANSION PIC32 I/O	1
MA180019 Roving Networks / Microchip Technology	MODULE PLUG-IN PICDEM LCD2	0
PCM16XT0 Roving Networks / Microchip Technology	PROCESSOR MODULE PIC16C925/926	4
ATSMARTCARD-XPRO Roving Networks / Microchip Technology	KIT EXTENSION XPLAINED PRO	0
ADM00861 Roving Networks / Microchip Technology	230VAC LED LOAD BOARD	3
MA330037 Roving Networks / Microchip Technology	DSPIC33EP512GM710 L PIM MODULE	4
AC320006 Roving Networks / Microchip Technology	KIT STARTER ADAPT BD PIC32MZ EC	9
MA320206 Roving Networks / Microchip Technology	ATSAMC21 MOTOR CONTROL PLUG IN M	0
MA330014 Roving Networks / Microchip Technology	MODULE DSPIC33 28P-100P QFP MC	0
MA330013 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC33 100TQFP	3
MA160015 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC16LF1947	5
MA330011 Roving Networks / Microchip Technology	MODULE DSPIC33 100P TO 100QFP	5

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization