| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
MOTOR AC ASYNCHRONOUS |
0 |
|
 |
Roving Networks / Microchip Technology |
PICSTART FIRMWARE (FLASH) V4.0 |
0 |
|
 |
Roving Networks / Microchip Technology |
MOD PIN 144PIN PIC32MZ BT |
0 |
|
 |
Roving Networks / Microchip Technology |
DEVICE ADAPTER 18F4220 40DIP |
0 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER KIT FOR 14PIN AVR MCU |
0 |
|
 |
Roving Networks / Microchip Technology |
STK600 LCD EXTENSION CARD |
0 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER KIT FOR 64PIN AVR MCU |
0 |
|
 |
Roving Networks / Microchip Technology |
PAK PERFORMANCE MPLAB REAL ICE |
0 |
|
 |
Roving Networks / Microchip Technology |
MPLABICE TRIPOD |
0 |
|
 |
Roving Networks / Microchip Technology |
PROC EXTENS PAK 24FJ128GA010-ICE |
0 |
|
 |
Roving Networks / Microchip Technology |
DEV F1 ACCY BLDC MOTOR ADD-ON |
0 |
|
 |
Roving Networks / Microchip Technology |
DEV BOARD PLUS USB MICROSTICK |
0 |
|
 |
Roving Networks / Microchip Technology |
CABLE ISP PROGRAMMER 8051 |
0 |
|
 |
Roving Networks / Microchip Technology |
TEST BD MPLAB REAL ICE LOOPBACK |
0 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER ICE 28DIP/SOIC/SSOP |
0 |
|
 |
Roving Networks / Microchip Technology |
KIT STARTER ATMEGA32M1/MEGA32C1 |
0 |
|
 |
Roving Networks / Microchip Technology |
MODULE PROCESSOR FOR PIC12F683 |
0 |
|
 |
Roving Networks / Microchip Technology |
DEVICE ADAPTER FOR PIC17C752 |
0 |
|
 |
Roving Networks / Microchip Technology |
PROCESSOR MODULE MPLAB-ICE 2000 |
0 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN PICDEM LCD2 85J90 |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization