| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Roving Networks / Microchip Technology |
DEVICE ADAPTER ICE2000 18DIP |
0 |
|
 |
Roving Networks / Microchip Technology |
PROCESSOR MODULE FOR PIC16F7X |
0 |
|
 |
Roving Networks / Microchip Technology |
REPLACEMENT CABLE W/ INTRFCE BRD |
0 |
|
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Roving Networks / Microchip Technology |
KIT MPLAB REAL ICE ISOLATOR |
0 |
|
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Roving Networks / Microchip Technology |
BOOK EMBEDDED C PROGRAMMING VOL2 |
0 |
|
 |
Roving Networks / Microchip Technology |
BOARD DRIVER MPLAB REAL ICE ICSP |
0 |
|
 |
Roving Networks / Microchip Technology |
EVAL BOARD FOR MIC USB |
0 |
|
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Roving Networks / Microchip Technology |
KIT EVAL USB QTOUCH PLUGIN/CARD |
0 |
|
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Roving Networks / Microchip Technology |
STARTER KIT AVR EXP MODULE 100P |
0 |
|
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Roving Networks / Microchip Technology |
HEADER MPLAB ICD2 24FJ64GA004 44 |
0 |
|
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Roving Networks / Microchip Technology |
MODULE PLUG-IN DSPIC33F 100TQFP |
0 |
|
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Roving Networks / Microchip Technology |
MODULE PROC18F4580/4680,1/2680,1 |
0 |
|
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Roving Networks / Microchip Technology |
ICEPIC PERSON BOARD FOR 16C5X |
0 |
|
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Roving Networks / Microchip Technology |
ROBOT ACCESSORY KIT |
0 |
|
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Roving Networks / Microchip Technology |
AVRONE TESTKIT |
0 |
|
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Roving Networks / Microchip Technology |
MODULE PROC PIC18F4685 |
0 |
|
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Roving Networks / Microchip Technology |
BOARD EXPANSION PROTOTYPING |
0 |
|
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Roving Networks / Microchip Technology |
BOOK GETTING STARTED UNO32 BOARD |
0 |
|
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Roving Networks / Microchip Technology |
MOTOR ADD-ON BDC FOR F1 LV EVAL |
0 |
|
 |
Roving Networks / Microchip Technology |
ADAPTER DEVICE FOR MPLAB-ICE |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization