Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	TDGL026 Roving Networks / Microchip Technology	CHIPKIT PMOD SHIELD	0
	MA160012 Roving Networks / Microchip Technology	DAUGHTER BOARD PICDEM PIC24F	0
	ATAVRONE-PROBE-5V Roving Networks / Microchip Technology	KIT PROBE FOR AVR UC3C	0
	ATSTK525 Roving Networks / Microchip Technology	KIT STARTER FOR AT90USB	0
	AC162083 Roving Networks / Microchip Technology	HEADER MPLAB ICD2 PIC16F616 8/14	0
	ACICE0108 Roving Networks / Microchip Technology	ADAPTER USB/PARALLEL ICE2000	0
	ATSTK594 Roving Networks / Microchip Technology	BOARD FPSLIC DAUGHTER FOR STK500	0
	AC244005-2 Roving Networks / Microchip Technology	MPLAB REAL ICE ISOLATOR PERF PAK	0
	PCM16XV0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR 16F8XXA	0
	DM164130-8 Roving Networks / Microchip Technology	MOTOR ADD-ON UNIPOLAR STEPPER F1	0
	ACICE0301 Roving Networks / Microchip Technology	8P SOIC HEADER TRANSITION	0
	ACICE0103 Roving Networks / Microchip Technology	MPLABICE POWER SUPPLY	0
	ATSTK502 Roving Networks / Microchip Technology	MOD EXPANSION AVR STARTER 500	0
	TDGL024 Roving Networks / Microchip Technology	BOARD DEV DIGILENT ANALOG DISCOV	0
	AC244006 Roving Networks / Microchip Technology	KIT MPLAB REAL ICE TRACE	0
	XLT28XP Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 28DIP	0
	MA180033 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC18F87J94	0
	MA180023 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC18F46J11 PIM	0
	DVA18XP280 Roving Networks / Microchip Technology	DEVICE ADAPTER 18F2220 28DIP	0
	PCM18XN1 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR ICE2000	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization