Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	PCM18XQ0 Roving Networks / Microchip Technology	MODULE PROCESSOR FOR MPLABICE	0
	DVA16PQ441 Roving Networks / Microchip Technology	ADAPTER DEVICE ICE 44QFP/TQFP	0
	PCM16XC0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR MPLAB-ICE	0
	MA330020 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC33F 44-QFN	0
	DVA17PQ801 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR PIC17C762	0
	ATSTK520 Roving Networks / Microchip Technology	ADAPTER KIT FOR 90PWM	0
	ATSTK504 Roving Networks / Microchip Technology	STARTER KIT AVR EXP MOD 100P LCD	0
	ATEVKLCD101 Roving Networks / Microchip Technology	KIT EVAL AVR32 VGA AUDIO	0
	BK0009 Roving Networks / Microchip Technology	BOOK EMBEDDED C PROGRAMMING VOL3	0
	DVA1003 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR ICE2000	0
	DV3204A Roving Networks / Microchip Technology	BOARD DGHTR QUAD/OCTL MCP3204/08	0
	DVA17XP401 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR PIC17C42A	0
	MA240026 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC24FJ16MC102	0
	BK0007 Roving Networks / Microchip Technology	PIC32 EDITION LITERATURE	0
	PCM16YP0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR PIC16F916	0
	AC162048 Roving Networks / Microchip Technology	PWR SUP W/CABLE FOR MICRCHP TOOL	0
	MA330029 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC33FJ16GP102	0
	TPDPTB1 Roving Networks / Microchip Technology	INTEGRATED CIRCUITS INTERFACE -	0
	PCM16XJ0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR MPLAB-ICE	0
	AC165202 Roving Networks / Microchip Technology	ICEPIC PERSON BOARD FOR 16C62X	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization