Accessories

Part Number	Description / PDF	Quantity
MA330048 Roving Networks / Microchip Technology	DSPIC33CK256MP506 DIGITAL POWER	19
AC244036 Roving Networks / Microchip Technology	IC EXTENSION PAK PIC16LF1939	3
MA330015 Roving Networks / Microchip Technology	MODULE DSPIC33 28P-100P QFP GP	0
MA330050-2 Roving Networks / Microchip Technology	MOD PIM DSPIC33CK64MP105 INT OA	4
AC164113 Roving Networks / Microchip Technology	MODULE INTERFACE ICD 3 TEST	6
MA240011 Roving Networks / Microchip Technology	MODULE PIC24 100P TO 100QFP	6
DVA17XL841 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR PIC17C762	2
ATADAP169_TOP Roving Networks / Microchip Technology	ADAPTER PERSON TOP ICE50 MEGA169	4
ATADAPCAN01 Roving Networks / Microchip Technology	EXTENSION CAN ADD-ON TO STK500/1	18
ATEVK525 Roving Networks / Microchip Technology	ADD ON KIT FOR STK525	11
AC162054 Roving Networks / Microchip Technology	HEADER INTERFACE ICD2 16F716	0
AC244024 Roving Networks / Microchip Technology	PROC EXTENS PAK PIC18LF1XK50	0
CG484 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 484-CCGA	0
CG1272 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 1272-CCGA	0
MA320207 Roving Networks / Microchip Technology	ATSAME54 MOTOR CONTROL PIM	0
LG1152 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 1152-CLGA	0
CORE429-RS232-CABLE Roving Networks / Microchip Technology	HDW RS232 CABLE FOR IP CORE429	0
ATBATTERY-CASE-2AAA Roving Networks / Microchip Technology	HOLDER BATT 2-AAA CELLS WIRE LDS	0
LG1657 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH	0
ATBATTERY-CASE-4AAA Roving Networks / Microchip Technology	HOLDER BATT 4-AAA CELLS WIRE LDS	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization