Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	CG624 DAISY CHAIN SIX Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 624-CCGA	0
	LG624 DAISY CHAIN-1 Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 624-CLGA	0
	MIXED-SIGNAL-DC Roving Networks / Microchip Technology	DAUGHTER CARD MIXED SIGNAL	0
	ATUSBUA-TO-OTGA Roving Networks / Microchip Technology	CABLE USB A-A	0
	IP-DC-SA Roving Networks / Microchip Technology	HARDWARE IP DAUGHTER CARD	0
	CG1657 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH	0
	CG1152 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 1152-CCGA	0
	LG1272 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 1272-CLGA	0
	MA330032 Roving Networks / Microchip Technology	MOD PIM DSPIC33FJ32MC104	0
	CG896 DAISY CHAIN Roving Networks / Microchip Technology	DAISY CHAIN PKG MECH 896-CCGA	0
	MA330033 Roving Networks / Microchip Technology	MOD PIM DSPIC33EP512GM706 INT	0
	SILICON-EXPLORER II Roving Networks / Microchip Technology	SOFTWARE ANALYSIS EXPLORER LOGIC	0
	SH-RTFG896-INTERPOSER Roving Networks / Microchip Technology	ADAPTER BOARD SOCKET	0
	MA180030 Roving Networks / Microchip Technology	BOARD DEMO PIC18F47J13 FS USB	0
	MA330025-3 Roving Networks / Microchip Technology	MOD PIM MOTOR DSPIC33EP512MU814	0
	ATMXT-XPRO Roving Networks / Microchip Technology	XPLAINED PRO MAXTOUCH EXTENSION	0
	DVA16XP401 Roving Networks / Microchip Technology	ADAPTER DEVICE ICE 40 DIP	0
	ATAVRONE-PROBE Roving Networks / Microchip Technology	AVRONE REPLACEMENT PROBE	0
	PCM16YR0 Roving Networks / Microchip Technology	MODULE PROC PIC16F88X	0
	DVA17PQ441 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR PIC17C42A	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization