Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	PCM16XK1 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR PIC16F87X	0
	XLT64PT4 Roving Networks / Microchip Technology	SOCKET TRAN ICE 64MQFP/TQFP	0
	DVA16XP182 Roving Networks / Microchip Technology	ADAPTR 712,716 DIP,SOIC,SSOP	0
	DVA12XP080 Roving Networks / Microchip Technology	ADAPTER DEVICE FOR MPLAB-ICE	0
	XLT84L1 Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 84PLCC	0
	ACICE0407 Roving Networks / Microchip Technology	CABLE FLEX FOR ICE 4000	0
	DVA16XL680 Roving Networks / Microchip Technology	ADAPTER DEVICE FOR MPLAB-ICE	0
	BK0003 Roving Networks / Microchip Technology	BOOK EMBEDDED C PROGRAMMING VOL1	0
	DVA17XL681 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR PIC17C752	0
	ACICE0403 Roving Networks / Microchip Technology	CABLE SLIM PARALLEL FOR ICE 4000	0
	MA180011 Roving Networks / Microchip Technology	MODULE PLUG-IN 18F25J10 28SOIC	0
	AC320004-2 Roving Networks / Microchip Technology	BOARD DAUGHTER PLUS IP101G PHY	0
	AC165212 Roving Networks / Microchip Technology	DAUGHTER BD FOR 16C84,F83,F84	0
	BK0006 Roving Networks / Microchip Technology	PIC LITERATURE/SPANISH	0
	ATEVKLCD100 Roving Networks / Microchip Technology	KIT EVAL AVR32 QVGA AUDIO	0
	DM164130-7 Roving Networks / Microchip Technology	MOTOR ADD-ON BIPOLAR STEPPER F1	0
	ATAVRDISPLAYX Roving Networks / Microchip Technology	KIT EVAL XMEGA DISPLAY	0
	MA330012 Roving Networks / Microchip Technology	MODULE DSPIC33 100P TO 84QFP	0
	MA240020 Roving Networks / Microchip Technology	MODULE PLUG-IN	0
	TC2030-CLIP-3PACK Roving Networks / Microchip Technology	BOARD CLIP EMULATE TAG-CONNECT	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization