Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	ATAVRONE-PROBECBL Roving Networks / Microchip Technology	AVRONE REPLACEMENT PROBECBL	0
	AC244008 Roving Networks / Microchip Technology	MONITOR MPLAB REAL ICE PWR	0
	AC244028 Roving Networks / Microchip Technology	PROC EXTENS PAK PIC24F16KA102	0
	AC160214-2 Roving Networks / Microchip Technology	BOARD DEV LIGHTING DMX512A ADAPT	0
	XLT68L1 Roving Networks / Microchip Technology	SOCKET TRANSITION ICE 68PLCC	0
	DV3201A Roving Networks / Microchip Technology	BOARD DGHTR SNGL/DUAL MCP3201/02	0
	DVA18XL840 Roving Networks / Microchip Technology	ADAPTER DEVICE ICE 84PLCC	0
	MA180012 Roving Networks / Microchip Technology	MODULE PLUG-IN 18LF25J10 28SOIC	0
	DM320005 Roving Networks / Microchip Technology	BOARD EXPANSION FOR PIC32 KIT	0
	AC300030 Roving Networks / Microchip Technology	KIT ACOUSTIC ACCESSORY	0
	AT641TAT-8IN-TSCREEN Roving Networks / Microchip Technology	8 GLASS TOUCHSCREEN FOR MXT641T	0
	ATF15XX-SAJ68 Roving Networks / Microchip Technology	ADAPTER FOR ATF15XX-DK2 68PLCC	0
	AT768EAT-8IN-TSCREEN Roving Networks / Microchip Technology	8 ITO TOUCHSCREEN /GLASS FOR MX	0
	PCM18XL0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR ICE2000	0
	TEMRS002 Roving Networks / Microchip Technology	PROGRAM EMBED RSLINK2 LOG-RS232	0
	PMF18WA1 Roving Networks / Microchip Technology	MODULE PROCESSOR ICE4000	0
	DVA1004 Roving Networks / Microchip Technology	DEVICE ADAPTER 8/14/20DIP	0
	MA18F4431 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC18F4431	0
	PCM18XE1 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR 18FXX20	0
	PMF18WE0 Roving Networks / Microchip Technology	PROCESSOR MODULE FOR ICE4000	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization