Accessories

Image Part Number Description / PDF Quantity Rfq
USB2ANY

USB2ANY

Texas Instruments

INTERFACE ADAPTER

118

PMICLOADBOARDEVM

PMICLOADBOARDEVM

Texas Instruments

ELECTRIC LOAD TRANSIENT BOARD

3

THUMBUS2300

THUMBUS2300

Texas Instruments

EVAL MODULE SMB

2

PRUCAPE

PRUCAPE

Texas Instruments

BOARD FOR BEAGLE BONE PRU CAPE

8

TMDXSDV6467T

TMDXSDV6467T

Texas Instruments

DAUGHTER CARD

2

HPA-MCUINTERFACE

HPA-MCUINTERFACE

Texas Instruments

BOARD INTERFACE FOR HPA-MCU

0

MULTI-CAL-SLAVEKIT

MULTI-CAL-SLAVEKIT

Texas Instruments

KIT BOARD MULTI-CAL-SLAVE SYST

4

TMDSCM572X

TMDSCM572X

Texas Instruments

TMDSEVM572X CAMERA MODULE

11

TLK10002SMAEVM

TLK10002SMAEVM

Texas Instruments

BOARD DAUGHTER SMA FOR TLK10002

3

DB-LM3S801

DB-LM3S801

Texas Instruments

DAUGHTER BOARD FOR LM3S801

0

SMA2RJ45EVK/NOPB

SMA2RJ45EVK/NOPB

Texas Instruments

BOARD ADAPTER SMA-RJ45

6

HVPMSMMTR

HVPMSMMTR

Texas Instruments

MOTOR PERM MAGNET SYNCH

11

EK-HDRS-D49RA

EK-HDRS-D49RA

Texas Instruments

BUNDLE HDRS/HOUSING TIVA C

12

TMDXWL1271DC18XL1X

TMDXWL1271DC18XL1X

Texas Instruments

WL1271 DAUGHTER CARD

2

TMDSADPEMU-20A

TMDSADPEMU-20A

Texas Instruments

ADAPTER JTAG EMULATOR 14/20 PIN

1

TMDSEMU110-ETH

TMDSEMU110-ETH

Texas Instruments

TMDSEMU110-ETH

5

SIDEGIG-PROTOEVM

SIDEGIG-PROTOEVM

Texas Instruments

DEVELOPMENT INTERFACE

1

CAPTIVATE-ISO

CAPTIVATE-ISO

Texas Instruments

CAPTIVATE ISOLATOR

413

2MTR-DYNO

2MTR-DYNO

Texas Instruments

DEV KIT DC MOTOR

16

CC256XEM-STADAPT

CC256XEM-STADAPT

Texas Instruments

KIT ADAPTER FOR CC256X

8

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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