Accessories

Image Part Number Description / PDF Quantity Rfq
SMV512K32-CVAL

SMV512K32-CVAL

Texas Instruments

BOARD BREAKOUT SMV512K32

3

ADSDESERADPT

ADSDESERADPT

Texas Instruments

ADS5281EVM TO ADSDESER-50EVM

2

TLK10034SMAEVM

TLK10034SMAEVM

Texas Instruments

SMA BREAKOUT DAUGHTRBRD TLK10034

1

TMDSFSIADAPEVM

TMDSFSIADAPEVM

Texas Instruments

FAST SERIAL INTERFACE ADAPTER

16

EMB1408MM/NOPB

EMB1408MM/NOPB

Texas Instruments

IC EMB1408MM/NOPB

0

EV2300

EV2300

Texas Instruments

EVALUATION MOD INTERFACE BOARD

0

DEVPACK-WATCH

DEVPACK-WATCH

Texas Instruments

DISPLAY FOR SENSORTAG

0

AFE-BREAKOUT-MVK

AFE-BREAKOUT-MVK

Texas Instruments

ADAPTER DGTL DEBUG AFE

0

CI2EVMBOC

CI2EVMBOC

Texas Instruments

BREAKOUT CARDS

0

EDSTRG28PLCC

EDSTRG28PLCC

Texas Instruments

EDSTRG28PLCC

0

430BOOST-SHARP96

430BOOST-SHARP96

Texas Instruments

SHARP MEMORY LCD BOOSTERPACK

0

TMDSADPEMU-20T

TMDSADPEMU-20T

Texas Instruments

ADAPTER PCB EMULATOR 14/20 PIN

0

EDSTRG44PLCC32

EDSTRG44PLCC32

Texas Instruments

EDSTRG44PLCC32

0

DB-LM3S811

DB-LM3S811

Texas Instruments

BOARD DAUGHTER FOR LM3S811 KIT

0

EV2200

EV2200

Texas Instruments

EVAL MOD BQ20XX GAS GAUGE IC'S

0

DB-LM3S828

DB-LM3S828

Texas Instruments

BOARD DAUGHTER FOR LM3S828 KIT

0

DB-LM3S817

DB-LM3S817

Texas Instruments

BOARD DAUGHTER FOR LM3S817 KIT

0

TMDSDIM100CON5PK

TMDSDIM100CON5PK

Texas Instruments

DIM100 CONNECTOR 5PK

0

MDL-ADA2

MDL-ADA2

Texas Instruments

ADAPTER MODULE 10-20PIN JTAG

0

EDSTRG28PLCC02

EDSTRG28PLCC02

Texas Instruments

EDSTRG28PLCC02

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

RFQ BOM Call Skype Email
Top