Accessories

Image Part Number Description / PDF Quantity Rfq
HVACIMTR

HVACIMTR

Texas Instruments

ACI MOTOR FOR TMDSHVMTRPFCKIT

0

COP8SA-PGMA

COP8SA-PGMA

Texas Instruments

ADAPTER SOIC 16,20,28,44 PLCC

0

DB-LM3S815

DB-LM3S815

Texas Instruments

BOARD DAUGHTER FOR LM3S815 KIT

0

EDSTRG28PLCCCX

EDSTRG28PLCCCX

Texas Instruments

EDSTRG28PLCCCX

0

DK-LM3S9B96-EM2

DK-LM3S9B96-EM2

Texas Instruments

EXPANSION BRD FOR LM3S9B96 KIT

0

EDSTRG44PLCC36

EDSTRG44PLCC36

Texas Instruments

EDSTRG44PLCC36

0

EDSTRG44PLCC05

EDSTRG44PLCC05

Texas Instruments

EDSTRG44PLCC05

0

5-6KINTERFACE

5-6KINTERFACE

Texas Instruments

KIT 5-6K INTERFACE BOARD

0

DB-LM3S301

DB-LM3S301

Texas Instruments

BOARD DAUGHTER FOR LM3S301 KIT

0

DB-LM3S818

DB-LM3S818

Texas Instruments

BOARD DAUGHTER FOR LM3S818 KIT

0

BOOSTXL-SENSHUB

BOOSTXL-SENSHUB

Texas Instruments

BOOSTER PACK SENSOR

0

DB-LM3S102

DB-LM3S102

Texas Instruments

BOARD DAUGHTER FOR LM3S102 KIT

0

TMDSADP1414-ISO

TMDSADP1414-ISO

Texas Instruments

ADAPTER FOR JTAG EMULATOR

0

DB-LM3S101

DB-LM3S101

Texas Instruments

BOARD DAUGHTER FOR LM3S101 KIT

0

BOOST-LMP92064EVM

BOOST-LMP92064EVM

Texas Instruments

BOOSTER PACK FOR LMP92064

0

EDSTRG44PLCC8X

EDSTRG44PLCC8X

Texas Instruments

EDSTRG44PLCC8X

0

EDSTRG44PLCCX

EDSTRG44PLCCX

Texas Instruments

EDSTRG44PLCCX

0

TMDSADP1460

TMDSADP1460

Texas Instruments

ADAPTER BOARD FOR JTAG EMULATOR

0

TMDS3780512A

TMDS3780512A

Texas Instruments

TMDS3780512A

0

TMDS3780511A

TMDS3780511A

Texas Instruments

TMDS3780511A

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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