Accessories

Image Part Number Description / PDF Quantity Rfq
TMDSBRD560

TMDSBRD560

Texas Instruments

TMDSBRD560

0

DM-COP8/28D

DM-COP8/28D

Texas Instruments

CABLE FOR DEBUG MODULE 28-DIP

0

EDSTRG64SDIL

EDSTRG64SDIL

Texas Instruments

EDSTRG64SDIL

0

ADSDESER-50EVM

ADSDESER-50EVM

Texas Instruments

MODULE EVAL FOR ADSDESER-50

0

TMDXEPK470

TMDXEPK470

Texas Instruments

TMDXEPK470

0

TMDX478R1080PN

TMDX478R1080PN

Texas Instruments

TMDX478R1080PN

0

TMDX470R1314PZ

TMDX470R1314PZ

Texas Instruments

TMDX470R1314PZ

0

TMDX478R1100PZ

TMDX478R1100PZ

Texas Instruments

TARGET CABLE 100-PIN FOR TMS470

0

TMDXVISDC8148BTA

TMDXVISDC8148BTA

Texas Instruments

DAUGHTER CARD BETA

0

COP8-EMFA-28N

COP8-EMFA-28N

Texas Instruments

EMULATOR NULL TARGET

0

COP8-EMFA-44P

COP8-EMFA-44P

Texas Instruments

EMULATOR TARGET PACKAGE ADAPTER

0

BQ27X00-TESTER

BQ27X00-TESTER

Texas Instruments

TEST SYSTEM FOR BQ27X00

0

TMDS37716016FN

TMDS37716016FN

Texas Instruments

TMDS37716016FN

0

COP8-PGMA-48TF1

COP8-PGMA-48TF1

Texas Instruments

PROGRAMMING ADAPTER

0

RF-BREAKOUT-MVK

RF-BREAKOUT-MVK

Texas Instruments

ADAPTER DGTL DEBUG RF

0

EDSTRG40SDILX

EDSTRG40SDILX

Texas Instruments

EDSTRG40SDILX

0

TMDXEA3503

TMDXEA3503

Texas Instruments

TMDXEA3503

0

TMDS37716A27FN

TMDS37716A27FN

Texas Instruments

TMDS37716A27FN

0

EDSTRG40DIL

EDSTRG40DIL

Texas Instruments

EDSTRG40DIL

0

EDSTRG28DIL

EDSTRG28DIL

Texas Instruments

EDSTRG28DIL

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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