Accessories

Image Part Number Description / PDF Quantity Rfq
MHW-SOIC20/NOPB

MHW-SOIC20/NOPB

Texas Instruments

ADAPTER DEBUG/ICE MSTR 20-SOIC

0

TMDSCBL560

TMDSCBL560

Texas Instruments

TMDSCBL560

0

COP8-EMFA-68P

COP8-EMFA-68P

Texas Instruments

EMULATOR TARGET PACKAGE ADAPTER

0

TMDS324G85K-07

TMDS324G85K-07

Texas Instruments

TMDS324G85K-07

0

TMDX4740600

TMDX4740600

Texas Instruments

TMDX4740600

0

COP8-PGMA-44CSF

COP8-PGMA-44CSF

Texas Instruments

PROGRAMMING ADAPTER

0

TMDSADP1420

TMDSADP1420

Texas Instruments

ADAPTER FOR JTAG EMULATOR

0

COP8-PGMA-28CSP

COP8-PGMA-28CSP

Texas Instruments

PROGRAMMING ADAPTER

0

TMDX3240030

TMDX3240030

Texas Instruments

TMDX3240030

0

TMDX3760216

TMDX3760216

Texas Instruments

TMDX3760216

0

DM-COP8/44P

DM-COP8/44P

Texas Instruments

CABLE FOR DEBUG MODULE 44-PLCC

0

TMDSDSPTXT

TMDSDSPTXT

Texas Instruments

SOFTWARE DSP DEV TECHNIQUES

0

USB2UWIRE-IFACE

USB2UWIRE-IFACE

Texas Instruments

BOARD USB INTERFACE LMK/LMX

0

TMDSMCD5505

TMDSMCD5505

Texas Instruments

DAUGHTER CARD FOR C5505 EVM

0

COP8-PGMA-28SO

COP8-PGMA-28SO

Texas Instruments

PROGRAMMING ADAPTER

0

EDSTRG40DILAX

EDSTRG40DILAX

Texas Instruments

EDSTRG40DILAX

0

TMDX4740000

TMDX4740000

Texas Instruments

TMDX4740000

0

COP8-EMFA-68N

COP8-EMFA-68N

Texas Instruments

EMULATOR NULL TARGET

0

TMDX470R1051

TMDX470R1051

Texas Instruments

TMDX470R1051

0

TMDX470R1054-17GJZ

TMDX470R1054-17GJZ

Texas Instruments

TMDX470R1054-17GJZ

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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