Accessories

Image Part Number Description / PDF Quantity Rfq
DPS-DONGLE-EVM

DPS-DONGLE-EVM

Texas Instruments

DONGLE

4

TMDSCNCD28335

TMDSCNCD28335

Texas Instruments

DAUGHTER CARD TMS320F28335

15

WLEDEVM-260

WLEDEVM-260

Texas Instruments

EVAL MOUDLE LOAD BOARD

2

TMDXIDK57X-LCD

TMDXIDK57X-LCD

Texas Instruments

AM57X IDK LCD KIT

2

FMC-ADC-ADAPTER

FMC-ADC-ADAPTER

Texas Instruments

HEADER ADAPTER CARD

0

TMDSADP1414

TMDSADP1414

Texas Instruments

ADAPTER FOR JTAG EMULATOR

3

MSP-FET-432ADPTR

MSP-FET-432ADPTR

Texas Instruments

MSP432 ADAPTER FOR MSP-FET

31

BOOSTXL-C2KLED

BOOSTXL-C2KLED

Texas Instruments

BOOSTER PACK LED C2000

76

LVSERVOMTR

LVSERVOMTR

Texas Instruments

MOTOR SERVO 60V

10

BOOST-IR

BOOST-IR

Texas Instruments

MODULE PLUG-IN IR BOOSTERPACK

35

TLK10002FPGAEVM

TLK10002FPGAEVM

Texas Instruments

BOARD DAUGHTER FPGA FOR TLK10002

1

TMDXEVMPCI

TMDXEVMPCI

Texas Instruments

ADAPTER CARD AMC TO PCIE

2

PUREPATH-CMBEVM

PUREPATH-CMBEVM

Texas Instruments

KIT DEV PUREPATH MOTHERBOARD

0

DK-LM3S9B96-FS8

DK-LM3S9B96-FS8

Texas Instruments

BOARD ADD-ON FOR DK-LM3S9B96

1

MSP-ISO

MSP-ISO

Texas Instruments

ISOLATION ADAPTER FOR MSP LAUNCH

9

LDCCOILEVM

LDCCOILEVM

Texas Instruments

EVAL MOD REFERENCE COIL BOARD

37

ADCRF2LA/NOPB

ADCRF2LA/NOPB

Texas Instruments

BOARD ADAPTER

3

TMDSCNCD2808

TMDSCNCD2808

Texas Instruments

DAUGHTER CARD TMS320F2808

20

BOOST-DRV8711

BOOST-DRV8711

Texas Instruments

BOOSTER PACK DRIVER

17

DEVPACK-LED-AUDIO

DEVPACK-LED-AUDIO

Texas Instruments

LED/AUDIO FOR SENSORTAG

4

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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