Accessories

Image Part Number Description / PDF Quantity Rfq
KIT-A1006-SHIELD

KIT-A1006-SHIELD

NXP Semiconductors

KIT-A1006-SHIELD

0

LFVDBGR

LFVDBGR

NXP Semiconductors

NEX BIT VERTICAL RIGID DBUG

0

LFSMPBS12XSCM

LFSMPBS12XSCM

NXP Semiconductors

DAUGHTER CARD 9S12XS 48-QFN

0

NXQ1TXH5DB1355

NXQ1TXH5DB1355

NXP Semiconductors

NXQ1TXH5 PLUG IN

0

LFSMPBS12XDFM

LFSMPBS12XDFM

NXP Semiconductors

DAUGHTER CARD 9S12XD 80-QFP

0

DSPCOMMPARALLELE

DSPCOMMPARALLELE

NXP Semiconductors

COMMAND CONV PARALLEL FOR DSP

0

FRDM-TWRPI

FRDM-TWRPI

NXP Semiconductors

SHIELD BOARD TWRPI CONNECTOR

0

DSPB721DB2E

DSPB721DB2E

NXP Semiconductors

DAUGHTER CARD B VERSION

0

LFSMPBS12XDIM

LFSMPBS12XDIM

NXP Semiconductors

DAUGHTER CARD 9S12XD 112-LQFP

0

SIPI-ERM8-ZIPCBL

SIPI-ERM8-ZIPCBL

NXP Semiconductors

SIPI ZIP WIRE CABLE 2X5 PIN SIP

0

KITLEDBKLT16EVBE

KITLEDBKLT16EVBE

NXP Semiconductors

KIT EVAL FOR ALL 16CH LED BOARDS

0

IMX-RMII-BRPHY

IMX-RMII-BRPHY

NXP Semiconductors

ENET 100MBPS CARD BR-PHY

7

IMXEBOOKDC4

IMXEBOOKDC4

NXP Semiconductors

KIT EVAL

0

DSPB724DB1E

DSPB724DB1E

NXP Semiconductors

DAUGHTER CARD C VERSION

0

TWRPI-KEYPAD

TWRPI-KEYPAD

NXP Semiconductors

ACCY BASIC 12 KEYPAD FOR TOWER

0

LFSTBPROTO

LFSTBPROTO

NXP Semiconductors

EVAL BOARD FOR

0

HSDC-EXTMOD01/DB

HSDC-EXTMOD01/DB

NXP Semiconductors

EXTENSION MODULE FOR ADC

0

CWH-UTP-CF-HE

CWH-UTP-CF-HE

NXP Semiconductors

USB TAP HOST TARGET

0

OM11007

OM11007

NXP Semiconductors

BOARD EXTENSION LPCSTICK

0

MPC8260ADS-FLASH

MPC8260ADS-FLASH

NXP Semiconductors

FLASH CHIP 8260ADS

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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