Accessories

Image Part Number Description / PDF Quantity Rfq
CWH-UTP-STC-HE

CWH-UTP-STC-HE

NXP Semiconductors

USB TAP FOR STARCORE

0

OM11079

OM11079

NXP Semiconductors

MODULE DIMM LPC3250 ARM9

0

LFSTBUSB

LFSTBUSB

NXP Semiconductors

BOARD INTERFACE ACCEL USB COMM

0

EVBUSB2SER

EVBUSB2SER

NXP Semiconductors

USB TO SERIAL BRIDGE

0

IMXEBOOKDC3-E

IMXEBOOKDC3-E

NXP Semiconductors

KIT EVAL FOR I.MX6SL

0

DSPB367DB1

DSPB367DB1

NXP Semiconductors

EVAL MODULE B VERSION DSP5636X

0

MFR4300FRDC

MFR4300FRDC

NXP Semiconductors

FRDC FLEXRAY DAUGHTER CARD

0

PQ-MDS-PCIEXP

PQ-MDS-PCIEXP

NXP Semiconductors

PCI EXPANDER ADAPTER

0

M68TC08JL3FA48E

M68TC08JL3FA48E

NXP Semiconductors

ADAPTER TARGET HEAD HC908JL3

0

MXC9KEYPAD-AB

MXC9KEYPAD-AB

NXP Semiconductors

BOARD KEYPAD

0

FLXRAYADPT500

FLXRAYADPT500

NXP Semiconductors

BOARD ADAPTER FOR MPC5XX

0

M68TQS064SAG1E

M68TQS064SAG1E

NXP Semiconductors

HARDWARE 64-QFP SOCKET

0

DSPCOMMPARALLEL

DSPCOMMPARALLEL

NXP Semiconductors

COMMAND CONV PARALLEL FOR DSP

0

UCEV104JP

UCEV104JP

NXP Semiconductors

UCODE I2C STARTER KIT

0

M68TE08LJLKFB52E

M68TE08LJLKFB52E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TC08JB8FB44E

M68TC08JB8FB44E

NXP Semiconductors

ADAPTER TARGET HEAD HC908JB8

0

MEVBU08CANKIT

MEVBU08CANKIT

NXP Semiconductors

KIT PROGRAMMER ADAPTER BOARD

0

OM11023

OM11023

NXP Semiconductors

BOARD EXTENSION LPC-STICK LCD

0

TWR-ZGWIFI

TWR-ZGWIFI

NXP Semiconductors

TOWER SYSTEM ZGWIFI

0

PQ-MDS-PIBE

PQ-MDS-PIBE

NXP Semiconductors

UNIVERSAL PLATFORM 83XXX

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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