| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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NXP Semiconductors |
KIT EVAL UNIVERSITY S12 LAB I |
0 |
|
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NXP Semiconductors |
BOARD DEV ADS POWERQUICC II |
0 |
|
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NXP Semiconductors |
ACCESSORY DAUGHTER BOARD |
0 |
|
 |
NXP Semiconductors |
DEV KIT FOR XTRINSIC SENSOR BT |
0 |
|
 |
NXP Semiconductors |
TOWER SYSTEM MEMORY PISMO |
0 |
|
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NXP Semiconductors |
DAUGHTER CARD FOR DEMO9S |
0 |
|
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NXP Semiconductors |
TOWER SYSTEM KIT AUDIO |
0 |
|
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NXP Semiconductors |
DISPLAY QVGA TFT FOR OM10100 |
0 |
|
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NXP Semiconductors |
HDWR ROTARY PLUG-IN FOR TOWER |
0 |
|
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NXP Semiconductors |
BOARD EXPANSION FOR DEMO KIT |
0 |
|
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NXP Semiconductors |
MODULE DIMM LPC2478 ARM7 |
0 |
|
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NXP Semiconductors |
DEV KIT FOR XTRINSIC SENSOR |
0 |
|
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NXP Semiconductors |
BOARD NGX MBED LPCXPRESSO |
0 |
|
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NXP Semiconductors |
BOARD BASE FOR LPCXPRESSO MBED |
0 |
|
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NXP Semiconductors |
MODULE LCD IMX233 4.3" WQVGA |
0 |
|
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NXP Semiconductors |
DAUGHTER CARD FOR DEMO9S |
0 |
|
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NXP Semiconductors |
LCD RGB MODULE FOR TWR SYSTEM |
0 |
|
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NXP Semiconductors |
ADAPTER MODULE TOWER SHIELD |
0 |
|
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NXP Semiconductors |
DEV KIT FOR 9AXIS XTRINSIC SNSR |
0 |
|
 |
NXP Semiconductors |
HDMI INTERFACE CARD FOR MX535/08 |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization