Accessories

Image Part Number Description / PDF Quantity Rfq
MPC5748G-GW-CBL

MPC5748G-GW-CBL

NXP Semiconductors

CABLE FOR MPC5748G-GW-RDB

2

TWR-MC36XSDEVB

TWR-MC36XSDEVB

NXP Semiconductors

BOARD TOWER PERIPHERAL MC36XSD

0

TWR-MC-FRDMKE02Z

TWR-MC-FRDMKE02Z

NXP Semiconductors

TOWER MOD KE BD TWR-MC-LV3PH

0

LFSMPBS12XEQM

LFSMPBS12XEQM

NXP Semiconductors

DAUGHTER CARD 9S12XE 208-MAPBGA

0

MPC830X-TLCD

MPC830X-TLCD

NXP Semiconductors

MODULE LCD DISPLAY FOR MPC830X

0

LFMAJ04PLT

LFMAJ04PLT

NXP Semiconductors

MPC5604P NEXUS DEBUG BOARD

0

LX2RDBKIT1-10-40

LX2RDBKIT1-10-40

NXP Semiconductors

RDB KIT TXRX CABLES 10GE & 40 GE

8

TSSELECTRODEEVM

TSSELECTRODEEVM

NXP Semiconductors

TSS ELECTRODE EVM KIT

0

IMXAISWC-ADAPT

IMXAISWC-ADAPT

NXP Semiconductors

IMXAISWC-ADAPT

0

BATT-6EMULATOR

BATT-6EMULATOR

NXP Semiconductors

BATT-6EMULATOR

0

ZN200-L-CB1

ZN200-L-CB1

NXP Semiconductors

CONSUMER VIDEO GRAPHIC HD PROCES

0

LFSMPBS12XSFM

LFSMPBS12XSFM

NXP Semiconductors

DAUGHTER CARD 9S12XS 80-QFP

0

DSPB720DB1E

DSPB720DB1E

NXP Semiconductors

DAUGHTER CARD B VERSION

0

LFSMPBS12XFFM

LFSMPBS12XFFM

NXP Semiconductors

DAUGHTER CARD 9S12XF 80-QFP

0

LFMAJ46CS1NT

LFMAJ46CS1NT

NXP Semiconductors

MPC5646C NEXUS DEBUG BOARD

0

BATT-14EMULATOR

BATT-14EMULATOR

NXP Semiconductors

BATT-14EMULATOR

0

OM13019,598

OM13019,598

NXP Semiconductors

EA 7" WVGA LCD DISPLAY KIT

3

APMOTOR56F8000E

APMOTOR56F8000E

NXP Semiconductors

KIT DEMO MOTOR CTRL SYSTEM

0

CWH-GTT-ACBL-YE

CWH-GTT-ACBL-YE

NXP Semiconductors

TRACE CABLE FOR GIGABIT TAP

0

MFR4310FRDC

MFR4310FRDC

NXP Semiconductors

FRDC FLEXRAY DAUGHTER CARD

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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