Accessories

Image Part Number Description / PDF Quantity Rfq
FRDM-PWRSTG1EVB

FRDM-PWRSTG1EVB

NXP Semiconductors

GD3000 MOSFET ACCESSORY BOARD

3

MCIMX-LVDS1

MCIMX-LVDS1

NXP Semiconductors

DAUGHTER CARD LVDS FOR I.MX53

13

TWR-ELEV

TWR-ELEV

NXP Semiconductors

TOWER ELEVATOR HARDWARE 2 BOARDS

51

CWH-CTP-CTX10-YE

CWH-CTP-CTX10-YE

NXP Semiconductors

HDWR CW TAP PROBE TIP LS1 LS2

4

LCD8000-43T

LCD8000-43T

NXP Semiconductors

ACCY MCIMX6UL LCD MODULE 4.3"

20

TWR-RF-MRB

TWR-RF-MRB

NXP Semiconductors

MODULE RF TOWER FOR MRB

0

SGMII-PEX-RISER

SGMII-PEX-RISER

NXP Semiconductors

PHY RISER CARD SGMII/PEX

2

IMXAI2ETH-ATH

IMXAI2ETH-ATH

NXP Semiconductors

ENET 1GBPS PHY (STD ENET PHY)

10

IMX-MIPI-HDMI

IMX-MIPI-HDMI

NXP Semiconductors

IMX-MIPI-HDMI

13

OM13518,598

OM13518,598

NXP Semiconductors

DEMO USB-I2C BUDS DONGLE

0

TWR-SER2

TWR-SER2

NXP Semiconductors

TOWER SYSTEM INTERFACE BOARD

6

IMX-LVDS-HDMI

IMX-LVDS-HDMI

NXP Semiconductors

LVDS TO HDMI ADAPT CARD-MINI SAS

0

OM13082UL

OM13082UL

NXP Semiconductors

SHIELD BOARD LPC GEN PURPOSE

3

OV10640CSP-S32V

OV10640CSP-S32V

NXP Semiconductors

OMNIVISION MIPI CAMERA FOR SBC-S

7

MCU-RGB-BOARD

MCU-RGB-BOARD

NXP Semiconductors

BOARD DEMO MCU I2C RGB

16

CWH-UTP-ONCE-HE

CWH-UTP-ONCE-HE

NXP Semiconductors

USB TAP DSC FOR HAWK HYBRID

81

DCF51AC256

DCF51AC256

NXP Semiconductors

DAUGHTER CARD FOR DEMOAC

0

LFSMPBS12XFLM

LFSMPBS12XFLM

NXP Semiconductors

DAUGHTER CARD 9S12XF 144-LQFP

0

LFSMPBS12XELM

LFSMPBS12XELM

NXP Semiconductors

DAUGHTER CARD 9S12XE 144-LQFP

0

S32V-SONYCAM

S32V-SONYCAM

NXP Semiconductors

SONY CAMERA FOR S32V234

6

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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