| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
NXP Semiconductors |
EXPANSION CARD I.MX51 |
3 |
|
 |
NXP Semiconductors |
HARDWARE MX50EBOOKDC1 |
2 |
|
 |
NXP Semiconductors |
MEMORY MODULE FOR TWR SYSTEM |
2 |
|
 |
NXP Semiconductors |
TFT3P5581-T |
19 |
|
 |
NXP Semiconductors |
TOWER SERIAL I/O HARDWARE |
9 |
|
 |
NXP Semiconductors |
CODEWARRIOR TAP PROBE TIP |
1 |
|
 |
NXP Semiconductors |
CONSUMER VIDEO GRAPHIC HD PROCES |
44 |
|
|
NXP Semiconductors |
KIT ACCY FLEX CBL LN C8 40/44PIN |
0 |
|
|
NXP Semiconductors |
DISPLAY MOD WVGA I.MX VYBRID 7" |
0 |
|
|
NXP Semiconductors |
DAUGHTER CARD 9S12XE 80-QFP |
0 |
|
|
NXP Semiconductors |
USB TAP PQI FOR ENHANCED BAC |
0 |
|
|
NXP Semiconductors |
BOARD VERT DBUG JT MCU RIGID |
0 |
|
|
NXP Semiconductors |
ETHERNET CARD PHY RISER P4080 |
2 |
|
|
NXP Semiconductors |
DAUGHTER CARD 9S12XS 52-QFP |
0 |
|
|
NXP Semiconductors |
HDWR CW TAP PROBE TIP VSPA |
0 |
|
|
NXP Semiconductors |
DAUGHTER CARD 9S12XE 112-LQFP |
0 |
|
|
NXP Semiconductors |
K32W-001-T10 |
24 |
|
|
NXP Semiconductors |
DAUGHTER CARD B VERSION |
0 |
|
|
NXP Semiconductors |
RDB KIT TXRX CABLES FOR 25G |
9 |
|
|
NXP Semiconductors |
NEX BIT VERTICAL FLEX DEBUG |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization