Accessories

Image Part Number Description / PDF Quantity Rfq
TH08QYT16E

TH08QYT16E

NXP Semiconductors

TARGET HEAD ADAPTER 16-TSSOP

0

M68TC08GZFB64E

M68TC08GZFB64E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TC08MR24FU64E

M68TC08MR24FU64E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TQS044SAF1E

M68TQS044SAF1E

NXP Semiconductors

HARDWARE CSIC MCU 44-QFP SOCKET

0

MPCRCOP-3V

MPCRCOP-3V

NXP Semiconductors

INTERFACE MPC COP

0

CWH-CTP-BDM-YE

CWH-CTP-BDM-YE

NXP Semiconductors

CODEWARRIOR TAP PROBE TIP

0

XAUI-RISER

XAUI-RISER

NXP Semiconductors

PHY RISER CARD XAUI

0

TH08QTDFN8E

TH08QTDFN8E

NXP Semiconductors

TARGET HEAD ADAPTER 8-DFN

0

TH08QTP8E

TH08QTP8E

NXP Semiconductors

TARGET HEAD ADAPTER 8DIP/SOIC

0

M68TC08MRFA32E

M68TC08MRFA32E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TC08JL8SP32E

M68TC08JL8SP32E

NXP Semiconductors

ADAPTER TARGET HEAD

0

HSDC-ACC01/DB

HSDC-ACC01/DB

NXP Semiconductors

ACCESSORY DAUGHTER BOARD

0

TH08JLP28E

TH08JLP28E

NXP Semiconductors

TARGET HEAD ADAPTER JL 2

0

LFDA8451

LFDA8451

NXP Semiconductors

MMA8451 DEVICE ADPTR BRD

0

M68TC08JB8P20E

M68TC08JB8P20E

NXP Semiconductors

ADAPTER TARGET HEAD HC908JB8

0

LFSTBBAT3

LFSTBBAT3

NXP Semiconductors

BOARD ACCELEROMETER 3.3V BATTERY

0

M68TC08GZFJ32E

M68TC08GZFJ32E

NXP Semiconductors

ADAPTER TARGET HEAD

0

DSPB374DB1

DSPB374DB1

NXP Semiconductors

DAUGHTER CARD B 374

0

M68TC08MR24B56E

M68TC08MR24B56E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TC08JW32FH52E

M68TC08JW32FH52E

NXP Semiconductors

ADAPTER TARGET HEAD JW32 52-LQFP

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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