Accessories

Image Part Number Description / PDF Quantity Rfq
310-024

310-024

Digilent, Inc.

COAXPOWER CABLE 2.1MM FEMALE

4

310-054

310-054

Digilent, Inc.

CABLE USB A TO MINI B

0

310-027

310-027

Digilent, Inc.

BLACK SPEAKER 4 OHM 5 WATT

0

300-031

300-031

Digilent, Inc.

POWER SUPPLY ZYBO

75

6002-310-000

6002-310-000

Digilent, Inc.

MXP EXTENDER CABLE FOR MYRIO

6

6003-310-001

6003-310-001

Digilent, Inc.

JTAG 2X7 RIBBON CABLE

201

240-116

240-116

Digilent, Inc.

HIGH SPEED LOGIC PROBES

1

250-061

250-061

Digilent, Inc.

4 PIN TO 2X2 PIN 9INCH MTE CABLE

0

6002-210-008

6002-210-008

Digilent, Inc.

MXP WIREWRAP 14X21 HOLE AREA

0

210-283

210-283

Digilent, Inc.

BREADBOARD MXP

0

240-040

240-040

Digilent, Inc.

WHEEL KIT PAIR 2.56" DIA SPLINE

4

240-110

240-110

Digilent, Inc.

2X6 PIN SPLIT CABLE

0

310-014

310-014

Digilent, Inc.

1 X 6 PIN MTE CABLE

20

240-038

240-038

Digilent, Inc.

SERVO BRACKET KIT PAIR

0

410-372

410-372

Digilent, Inc.

FMC PCAM ADAPTER

11

250-060

250-060

Digilent, Inc.

4 PIN TO 4 PIN 9INCH MTE CABLE

0

250-059

250-059

Digilent, Inc.

USB CABLE A TO B

0

6002-410-011

6002-410-011

Digilent, Inc.

MOTOR ADAPT FOR NI MYRIO

4

240-108

240-108

Digilent, Inc.

ACCY PROJECT BOX + STICKER SHEET

17

310-025

310-025

Digilent, Inc.

2-PIN MTE POWER CABLE

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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