Accessories

Image Part Number Description / PDF Quantity Rfq
240-111

240-111

Digilent, Inc.

CONNECTOR VHDCI 2X34 PIN MALE RA

0

250-045P

250-045P

Digilent, Inc.

VHDCI MALE/MALE 16INCH CABLE

0

593-003P

593-003P

Digilent, Inc.

INTRO TO DGTL DESIGN VERILOG

0

593-001P

593-001P

Digilent, Inc.

DGTL DESIGN VERILOG 2ND EDITION

0

350-000

350-000

Digilent, Inc.

512MB DDR DRAM FOR V2PRO

0

593-002P

593-002P

Digilent, Inc.

INTRO TO DGTL DESIGN VHDL

0

380-046P

380-046P

Digilent, Inc.

CHIPKIT PROTOSHIELD MAX 32

0

250-041P

250-041P

Digilent, Inc.

XUP FLY WIRE ASSEMBLY

0

593-004P

593-004P

Digilent, Inc.

REAL DGTL A HANDS-ON APPROACH

0

6003-170-002P

6003-170-002P

Digilent, Inc.

V2PRO PROTECTIVE COVER

0

6026-410-002P-BOARD

6026-410-002P-BOARD

Digilent, Inc.

FMC SDP INTERPOSER BOARD

0

240-002

240-002

Digilent, Inc.

DIGITAL PARTS KIT

0

240-009P

240-009P

Digilent, Inc.

BREADBOARD ADD-ON FX2BB

0

210-184-2P

210-184-2P

Digilent, Inc.

VMODWW VHDC WIREWRAP BOARD

0

380-045P

380-045P

Digilent, Inc.

CHIPKIT PROTOSHIELD UNO 32

0

D300-010-3

D300-010-3

Digilent, Inc.

ACCY V2PRO P/S UK PLUG

0

310-022-1

310-022-1

Digilent, Inc.

IEC US PLUG CABLE

0

D300-010-2

D300-010-2

Digilent, Inc.

ACCY V2PRO P/S EU PLUG

0

310-022-2

310-022-2

Digilent, Inc.

IEC EU PLUG CABLE

0

6003-210-012P

6003-210-012P

Digilent, Inc.

FMC-CE IO EXPANSION CARD

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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