Accessories

Image Part Number Description / PDF Quantity Rfq
240-037

240-037

Digilent, Inc.

ACCY IR RANGE SENSOR

0

240-020

240-020

Digilent, Inc.

STANDOFFS AND SCREWS SET OF 4

0

240-072

240-072

Digilent, Inc.

ZUNO CLIPS

0

240-062

240-062

Digilent, Inc.

PIN HEADER 2X6

0

6002-410-006

6002-410-006

Digilent, Inc.

MYDIGITAL FOR MYDAQ/MYRIO

19

240-021-12

240-021-12

Digilent, Inc.

CABLE CONNECTOR 6PIN 12"

0

290-022

290-022

Digilent, Inc.

STICKY RUBBER WHEELS PAIR

1

163-165

163-165

Digilent, Inc.

4 AA BATTERY HOLDER

0

240-007

240-007

Digilent, Inc.

2-PIN MTE CABLE 18INCH PACK OF 5

0

240-053

240-053

Digilent, Inc.

HDMI CABLE

0

300-036

300-036

Digilent, Inc.

60W PCIE 12V 5A POWER SUPPLY

0

240-030

240-030

Digilent, Inc.

POWER SUPPLY SWPS 5VDC 4A

0

210-184-1P

210-184-1P

Digilent, Inc.

VMODBB BREADBOARD

0

240-067

240-067

Digilent, Inc.

ACCY KIT ZYBO W/VIVADO

0

310-009

310-009

Digilent, Inc.

6-PIN CABLE 6INCH

0

300-009

300-009

Digilent, Inc.

US TO UK WALL PLUG ADAPTER

0

240-035

240-035

Digilent, Inc.

PICKIT 3 PROGRAMMING CABLE KIT

0

163-433P

163-433P

Digilent, Inc.

CONNECTOR VHDCI 2X34 PIN MALE RA

0

210-190P

210-190P

Digilent, Inc.

VMODMIB VHDCI INTERFACE BOARD

0

240-025

240-025

Digilent, Inc.

MAIN PLATE EXPANSION KIT

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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