Accessories

Image Part Number Description / PDF Quantity Rfq
6002-410-012

6002-410-012

Digilent, Inc.

HIGH CURRENT ADAPTER FOR NI MYRI

0

300-008

300-008

Digilent, Inc.

US TO EU WALL PLUG ADAPTER

0

240-000

240-000

Digilent, Inc.

ANALOG PARTS KIT

0

240-015

240-015

Digilent, Inc.

WHEEL KIT PAIR 2.56" DIA D-SLOT

6

163-062

163-062

Digilent, Inc.

FX2 SOCKET CONNECTOR HIROSE

0

350-001

350-001

Digilent, Inc.

256MB DDR DRAM FOR V2PRO

0

250-047

250-047

Digilent, Inc.

UART CROSSOVER CABLE 6 PIN 6INCH

0

240-012

240-012

Digilent, Inc.

IR PROXIMITY SENSOR 2 PACK

5

240-130

240-130

Digilent, Inc.

ZYBO Z7-20 FAN KIT

9

240-006

240-006

Digilent, Inc.

2-PIN MTE CABLE 9INCH PACK OF 5

0

593-005

593-005

Digilent, Inc.

GETTING STARTED WITH CHIPKIT

0

6002-410-009

6002-410-009

Digilent, Inc.

SHIELD ADAPT FOR NI MYRIO

0

6003-300-000

6003-300-000

Digilent, Inc.

POWER SUPPLY 60W

43

290-023

290-023

Digilent, Inc.

KIT GWS SERVO CONT ROTATION

0

310-011

310-011

Digilent, Inc.

ETHERNET CAT5E CABLE 10FEET

0

240-107

240-107

Digilent, Inc.

PMOD CLIP WITH SCREW AND NUT

108

6003-170-003

6003-170-003

Digilent, Inc.

HEATSINK -WITH CLIP

0

240-004

240-004

Digilent, Inc.

6-PIN HEADER PACK OF 5

0

240-078

240-078

Digilent, Inc.

PMOD 6PIN FEMALE R/A CONN 5PACK

0

310-100

310-100

Digilent, Inc.

ANALOG DISCOVERY 2X15 CABLE

64

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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