Accessories

Image Part Number Description / PDF Quantity Rfq
310-051

310-051

Digilent, Inc.

HDMI TYPE A-D MICRO CABLE 40INCH

0

240-057

240-057

Digilent, Inc.

12V, 3A POWER SUPPLY

0

240-005

240-005

Digilent, Inc.

1-PIN MTE CABLE PACK OF 5

12

240-021-18

240-021-18

Digilent, Inc.

PMOD CABLE KIT: 6-PIN 18"

34

240-012-18

240-012-18

Digilent, Inc.

6-PIN CABLE 18INCH

0

6002-410-010

6002-410-010

Digilent, Inc.

NXT SENSOR FOR NI MYRIO

2

290-010

290-010

Digilent, Inc.

GWS SERVO KIT WITH FUTABA CONN

0

250-084

250-084

Digilent, Inc.

MOTOR EXTENDER CABLE

9

163-053

163-053

Digilent, Inc.

DIP SOCKET 40-PIN

0

240-023

240-023

Digilent, Inc.

ANGLED PLATFORM EXPANSION KIT

0

410-263

410-263

Digilent, Inc.

ADAPTER BOARD ANLG DISCOVERY BNC

131

240-079

240-079

Digilent, Inc.

PMOD 6PIN MALE R/A CONN 5PACK

20

310-053

310-053

Digilent, Inc.

CABLE USB A TO MICRO B

55

240-052

240-052

Digilent, Inc.

MINI GRABBERS TEST CLIP SET OF 6

17

240-114

240-114

Digilent, Inc.

PYNQ-Z1 ACCESSORY KIT

0

240-021-2

240-021-2

Digilent, Inc.

PMOD 12-PIN CABLE KIT W/HEADER

113

240-109

240-109

Digilent, Inc.

2X6 12-PIN 7INCH CABLE

0

240-024

240-024

Digilent, Inc.

ROUND PLATFORM EXPANSION KIT

0

240-021-6

240-021-6

Digilent, Inc.

PMOD 6-PIN CABLE KIT W/HEADER

112

163-043

163-043

Digilent, Inc.

2 AA BATTERY HOLDER

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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