Accessories

Image Part Number Description / PDF Quantity Rfq
EVKT-USBI2C-02

EVKT-USBI2C-02

MPS (Monolithic Power Systems)

USB TO I2C/PMBUS DONGLE

0

8.07.01 SWD ISOLATOR

8.07.01 SWD ISOLATOR

Segger Microcontroller Systems

ISOLATOR J-LINK SWD

8

SC0124

SC0124

Raspberry Pi

CGL 6MM, WIDE ANGLE LENS

44

MIKROE-86

MIKROE-86

MikroElektronika

KEYPAD BOARD 4X4 PB

5

MSCNC4433E-500

MSCNC4433E-500

Roving Networks / Microchip Technology

NSHIELD SOLO HSM PCIE CARD

0

BBEXPDTR70

BBEXPDTR70

LCD 7.0" RES-TOUCH BEAGLE BONE

7

450-00310

450-00310

Parallax, Inc.

CONNECTOR SOCKET FOR P2 EDGE (ST

20

MIKROE-194

MIKROE-194

MikroElektronika

BOARD EASYCONNECT2

0

MIKROE-410

MIKROE-410

MikroElektronika

BOOK PIC MCU PROGRAMMING IN C

0

EA-QSB-100

EA-QSB-100

Embedded Artists

BOARD QUICK START

0

AC002023

AC002023

Roving Networks / Microchip Technology

CURRENT MEASUREMENT CABLE

5

STEVAL-IPE023V1

STEVAL-IPE023V1

STMicroelectronics

BOARD USB INTERFACE STPMXX

13

MA240016-2

MA240016-2

Roving Networks / Microchip Technology

DAUGHTER BOARD PIC24HJ

3

CAM007

CAM007

Pimoroni

CAMERA CABLE ADAPTER

8

MA330051-2

MA330051-2

Roving Networks / Microchip Technology

DSPIC33CK64MC105 PIM MODULE

8

MA240014

MA240014

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC24

9

THUMBUS2300

THUMBUS2300

Texas Instruments

EVAL MODULE SMB

2

XLT44QFN2

XLT44QFN2

Roving Networks / Microchip Technology

SOCKET TRAN ICE 44QFN/40DIP

1

PIM330

PIM330

Pimoroni

POGO-A-GO-GO POGO PINS HARDWARE

24

20-101-1201

20-101-1201

Digi

USB PROGRAMMING CABLE 2MM CONN

99

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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