Accessories

Image Part Number Description / PDF Quantity Rfq
EVAL-SDP-CK1Z

EVAL-SDP-CK1Z

Analog Devices, Inc.

CONTROLLER BOARD

30

DAB-001001

DAB-001001

USB2IO INTERFACE EXPLORER

2

CVM50XM

CVM50XM

TechTools

MEMBER MOD PIC12C508/PIC12C509

0

TEACL-USB

TEACL-USB

ADAPTER USB TEACLIPPER

61

AC244061

AC244061

Roving Networks / Microchip Technology

EXTENSION PAK PIC16F527

3

10139

10139

Phase Dock Inc.

RASPBERRY PI ZERO MOUNTING ADAPT

25

300-031

300-031

Digilent, Inc.

POWER SUPPLY ZYBO

75

EPCDESIGNTOOL_MD-EM

EPCDESIGNTOOL_MD-EM

EPC

ENGR DIE FOR ELECTROMIGRATION

5

MA330018

MA330018

Roving Networks / Microchip Technology

PIM DSPIC33F MC 44P-100P QFN

0

CY3250-20434QFN-POD

CY3250-20434QFN-POD

IR (Infineon Technologies)

PSOC POD FOR CY8C20434 QFN

0

CY3250-24X23A-POD

CY3250-24X23A-POD

IR (Infineon Technologies)

EVAL KITS/TOOLS

0

10141

10141

Phase Dock Inc.

JETSON NANO MOUNTING ADAPTER

25

MA180031

MA180031

Roving Networks / Microchip Technology

MOD PLUG-IN 44PIN PIC18F46K80

6

ADZS-180PWM-SAM

ADZS-180PWM-SAM

Analog Devices, Inc.

BOARD PROBING PWM 180-PIN

2

6002-310-000

6002-310-000

Digilent, Inc.

MXP EXTENDER CABLE FOR MYRIO

6

114992266

114992266

Seeed

IMX219-160 REPLACEMENT CAMERA MO

40

PMICLOADBOARDEVM

PMICLOADBOARDEVM

Texas Instruments

ELECTRIC LOAD TRANSIENT BOARD

3

3569

3569

Adafruit

SMARTIPI TOUCH BACK COVER - SMAL

0

2JCIE-HARNESS-02

2JCIE-HARNESS-02

Omron Electronics Components

HARNESS FOR 2JCIE EVAL BOARD

14

IMXEBOOKDC2

IMXEBOOKDC2

NXP Semiconductors

KIT EVAL FOR I.MX50

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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