Accessories

Image Part Number Description / PDF Quantity Rfq
3568

3568

Adafruit

STEMMA CABLE - 150MM/6 LONG 4 PI

0

EVAL-XLMOUNT1

EVAL-XLMOUNT1

Analog Devices, Inc.

MOUNTING BLOCK FOR ACCELEROMETER

30

MIKROE-202

MIKROE-202

MikroElektronika

DISPLAY BOARD 2 SERIAL 7SEGMENT

0

2JCIE-HARNESS-01

2JCIE-HARNESS-01

Omron Electronics Components

HARNESS FOR 2JCIE EVAL BOARD

25

CVM55XM

CVM55XM

TechTools

MEMBER MODULE PIC16C554/556/558

2

EVAL-FW-HPMFB1

EVAL-FW-HPMFB1

Analog Devices, Inc.

DAUGHTER BOARD HPMFB1

0

MIKROE-76

MIKROE-76

MikroElektronika

COMPACT FLASH BOARD

0

CWH-DONGLE

CWH-DONGLE

NXP Semiconductors

KIT USB DONGLE DEVICE

7

IOSHIELD_K

IOSHIELD_K

WIZnet

IOSHIELD FOR GR_KURUMI

0

UPIO-I2S-AUDIO-EK

UPIO-I2S-AUDIO-EK

Silicon Labs

BOARD DEV AUDIO I/O I2S UDP

0

MA180026

MA180026

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC18F45K20

3

1664

1664

Adafruit

5-PIN JST SM PLUG/RECEPTACLE SET

0

MA240016

MA240016

Roving Networks / Microchip Technology

MODULE PLUG-IN 24HJ128GP504

5

ASR00015-100

ASR00015-100

TinyCircuits

2-PIN JST-SH PIGTAIL 100MM

0

XLT44QFN4

XLT44QFN4

Roving Networks / Microchip Technology

SOCKET TRANS ICE 28DIP TO 44QFN

10

EV-ADUCM350-SMCZ

EV-ADUCM350-SMCZ

Analog Devices, Inc.

EVAL BOARD FOR ADUCM350

0

TWR-IND-IO

TWR-IND-IO

NXP Semiconductors

TOWER IND CTRL IO MODULE

1

BBEXPDTR43

BBEXPDTR43

LCD 4.3" RES-TOUCH BEAGLE BONE

17

KIT-16389

KIT-16389

SparkFun

DLI KIT (WITHOUT JETSON NANO)

9

MIKROE-201

MIKROE-201

MikroElektronika

DISPLAY BOARD SERIAL 7SEGMENT

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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