Accessories

Part Number	Description / PDF	Quantity
MA180014 Roving Networks / Microchip Technology	MODULE PLUG-IN 18LF45J10 44TQFP	15
PRUCAPE Texas Instruments	BOARD FOR BEAGLE BONE PRU CAPE	8
LS-CAB4P-08 OSEPP Electronics	M/M 4PIN CONN I2C CABLE 8" 4PACK	92
DFR0164 DFRobot	USB SERIAL LIGHT ADAPTER - ATMEG	0
AC244054 Roving Networks / Microchip Technology	PIC16LF1459-ICE PROCR EXT PAK	0
IOSHIELD_A WIZnet	IOSHIELD FOR ARDUINO	1
114020163 Seeed	GROVE FEMALE HEADER 20PACK	599
AC162052 Roving Networks / Microchip Technology	14P ICD 2 HEADER	0
TE0791-01 Trenz Electronic	XMOD JTAG CONNECTOR	6
MA330016 Roving Networks / Microchip Technology	MODULE DSPIC33 44P-100P QFP GP	4
TMDXSDV6467T Texas Instruments	DAUGHTER CARD	2
8.06.12 J-LINK SIGNAL SMOOTHING ADAPTER Segger Microcontroller Systems	J-LINK SIGNAL SMOOTHING ADAPTER	1
EA-ACC-027 Embedded Artists	LABTOOL CABLE 26-POS	0
DVA17XL441 Roving Networks / Microchip Technology	DEVICE ADAPTER FOR PIC17C42A	1
FRDM-MC-LVMTR NXP Semiconductors	MOTOR 3-PH BLDC 4000R/MIN 24V 2.	10
MIKROE-486 MikroElektronika	BOARD EASY PS/2	0
60-00001 Tensility International Corporation	PWR DIST BRD 5.5X2.5 JACK/TERM	499
6003-310-001 Digilent, Inc.	JTAG 2X7 RIBBON CABLE	201
3552 Adafruit	STRAIGHT MINI HDMI PLUG ADAPTER	357
240-116 Digilent, Inc.	HIGH SPEED LOGIC PROBES	1

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization