Accessories

Image Part Number Description / PDF Quantity Rfq
PIM461

PIM461

Pimoroni

FAN SHIM FOR RASPBERRY PI

80

1992

1992

Adafruit

GPIO HEADER FOR RASPBERRYPI A+/B

582

M37478E8SS

M37478E8SS

Renesas Electronics America

8-BIT, OTPROM, MELPS740 CPU

0

250-061

250-061

Digilent, Inc.

4 PIN TO 2X2 PIN 9INCH MTE CABLE

0

MCIMX8-8X-BB

MCIMX8-8X-BB

NXP Semiconductors

BASEBRD I.MX 8QUADXPLUS/8QUADMAX

8

8.06.13 J-LINK MEASUREMENT+PATCH ADAPTER

8.06.13 J-LINK MEASUREMENT+PATCH ADAPTER

Segger Microcontroller Systems

ADAPTER J-LINK MEASUREMENT+PATCH

4

2336

2336

Adafruit

BRASS M2.5 STANDOFFS FOR PI HATS

0

HPA-MCUINTERFACE

HPA-MCUINTERFACE

Texas Instruments

BOARD INTERFACE FOR HPA-MCU

0

TC2050-CLIP-3PACK

TC2050-CLIP-3PACK

Tag-Connect

BOARD RETAINING TC2050-NL 3PACK

291

4378

4378

Adafruit

SMARTIPI TOUCH 2 BACK COVER LARG

16

3558

3558

Adafruit

RIGHT ANGLE (L BEND) MICRO HDMI

26

MULTI-CAL-SLAVEKIT

MULTI-CAL-SLAVEKIT

Texas Instruments

KIT BOARD MULTI-CAL-SLAVE SYST

4

PIS-1275

PIS-1275

Pi Supply

CRYSTAL BATTERY BOX - 2 X AAA

24

6002-210-008

6002-210-008

Digilent, Inc.

MXP WIREWRAP 14X21 HOLE AREA

0

MIKROE-1025

MIKROE-1025

MikroElektronika

BOARD EASYINPUT IDC10 PORT

0

EVALSP1340HDM

EVALSP1340HDM

STMicroelectronics

PLUGBOARD CLCD HDMI TRANSMITTER

1

210-283

210-283

Digilent, Inc.

BREADBOARD MXP

0

AC320212

AC320212

Roving Networks / Microchip Technology

565 LCD GFX CARD

5

STEVAL-ILL018V3

STEVAL-ILL018V3

STMicroelectronics

BOARD EVAL OSRAM RED LA W55M

0

PRT-10474

PRT-10474

SparkFun

XT60 CONNECTORS MALE/FEMALE PAIR

3552

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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